18490995. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Choongbin Yim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18490995 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation:
The semiconductor package described in the patent application consists of multiple redistribution structures and bonding pads, with a bonding wire connecting them. A molding layer covers the components to protect them.
- The semiconductor package includes multiple redistribution structures and bonding pads.
- A bonding wire connects the redistribution bonding pads.
- A molding layer covers the components for protection.
Key Features and Innovation:
- Utilizes multiple redistribution structures for enhanced connectivity.
- Incorporates bonding wire for electrical connection between redistribution bonding pads.
- Molding layer provides protection to the components.
Potential Applications:
- Semiconductor industry for packaging and connecting chips.
- Electronics manufacturing for integrated circuits.
- Consumer electronics for compact and efficient devices.
Problems Solved:
- Improved connectivity between semiconductor components.
- Enhanced protection for delicate components.
- Streamlined packaging process for semiconductor chips.
Benefits:
- Increased reliability of semiconductor packages.
- Enhanced performance of electronic devices.
- Cost-effective manufacturing process.
Commercial Applications:
The technology described in the patent application can be utilized in the semiconductor industry for packaging and connecting chips, electronics manufacturing for integrated circuits, and consumer electronics for compact and efficient devices. This innovation offers improved connectivity, enhanced protection, and streamlined packaging processes, leading to increased reliability, enhanced performance, and cost-effective manufacturing.
Questions about Semiconductor Package Technology:
1. What are the potential applications of this semiconductor package technology? 2. How does the bonding wire improve the connectivity of the components in the semiconductor package?
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Original Abstract Submitted
A semiconductor package includes a first redistribution structure including a first redistribution layer and a first redistribution bonding pad, the first redistribution bonding pad electrically connected to the first redistribution layer, a first semiconductor chip on the first redistribution structure, and a second redistribution structure on the first semiconductor chip, the second redistribution structure including a second redistribution layer and a second redistribution bonding pad, the second redistribution layer electrically connected to the second redistribution layer. The semiconductor package includes a bonding wire electrically connecting the second redistribution bonding pad and the first redistribution bonding pad to each other, and a molding layer covering at least a portion the first semiconductor chip, the second redistribution structure, and the bonding wire on the first redistribution structure.
