18490212. INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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INTEGRATED CIRCUIT DEVICE
Organization Name
Inventor(s)
INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18490212 titled 'INTEGRATED CIRCUIT DEVICE
The abstract describes an integrated circuit device with various components such as word lines, bit lines, bit line contacts, doping contacts, cell pads, buried contacts, and conductive landing pads.
- The device includes a substrate with an active region and a word line extending in a first horizontal direction.
- A bit line extends on the word line in a second horizontal direction, with a bit line contact electrically connecting the bit line to the active region.
- A doping contact connects the bit line contact to the active region, with a first and second doping contact of different thicknesses in the vertical direction.
- The cell pad has a horizontal width greater than that of the active region, with a buried contact digging into one side wall of the cell pad.
- A conductive landing pad faces the bit line in the first horizontal direction.
Potential Applications: - Memory devices - Microprocessors - Integrated circuits
Problems Solved: - Efficient electrical connections in integrated circuits - Improved performance and reliability of electronic devices
Benefits: - Enhanced functionality of electronic devices - Increased speed and efficiency of data processing - Higher reliability and durability of integrated circuits
Commercial Applications: Title: "Advanced Integrated Circuit Technology for Enhanced Performance" This technology can be utilized in various industries such as telecommunications, consumer electronics, automotive, and aerospace for developing high-performance electronic devices.
Prior Art: Readers can explore prior patents related to integrated circuit design, semiconductor technology, and electronic device manufacturing to understand the evolution of this technology.
Frequently Updated Research: Researchers are constantly working on improving integrated circuit design, semiconductor materials, and manufacturing processes to enhance the performance and efficiency of electronic devices.
Questions about Integrated Circuit Devices: 1. How does the thickness of the doping contacts affect the performance of the integrated circuit device? 2. What are the key advantages of using buried contacts in the design of electronic devices?
Original Abstract Submitted
An integrated circuit device includes a substrate having an active region, a word line extending in the substrate in a first horizontal direction, a bit line extending on the word line in a second horizontal direction, a bit line contact electrically connecting the bit line to the active region, a doping contact connecting the bit line contact to the active region, a cell pad having a horizontal width greater than that of the active region, a buried contact that digs into one side wall of the cell pad, and a conductive landing pad facing the bit line in the first horizontal direction. The doping contact includes a first doping contact and a second doping contact, and a thickness of the first doping contact in the vertical direction is less than that of the second doping contact in the vertical direction.
