18489999. MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (Toyota Jidosha Kabushiki Kaisha)

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Organization Name

Toyota Jidosha Kabushiki Kaisha

Inventor(s)

Yuji Nagumo of Nisshin-shi (JP)

Masashi Uecha of Nisshin-shi (JP)

Masaru Okuda of Nisshin-shi (JP)

Masatake Nagaya of Nisshin-shi (JP)

Mitsuru Kitaichi of Settsu-city (JP)

Akira Mori of Settsu-city (JP)

Naoya Kiyama of Settsu-city (JP)

Masakazu Takeda of Settsu-city (JP)

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18489999 titled 'MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Simplified Explanation

The manufacturing method of a semiconductor device involves forming element structures in a matrix on a semiconductor wafer, creating a crack along the boundaries between the element structures, and then dividing the wafer along these boundaries.

• Forming element structures in a matrix on a semiconductor wafer
• Creating a crack along the boundaries between the element structures by pressing a member against the wafer
• Dividing the wafer along the boundaries by pressing a dividing member against the wafer

Potential Applications

This technology can be applied in the manufacturing of various semiconductor devices such as integrated circuits, sensors, and microprocessors.

Problems Solved

This method helps in efficiently dividing semiconductor wafers into individual devices, reducing manufacturing time and costs.

Benefits

- Improved efficiency in semiconductor device manufacturing - Enhanced precision in dividing semiconductor wafers - Cost-effective production process

Potential Commercial Applications

Optimizing Semiconductor Wafer Division Method for Enhanced Manufacturing Efficiency

Possible Prior Art

There may be prior art related to semiconductor wafer division methods using different techniques or equipment. Research into existing patents and publications in the semiconductor industry may reveal similar technologies.

Unanswered Questions

How does this method compare to traditional semiconductor wafer division techniques?

Answer: This article does not provide a direct comparison with traditional methods, leaving the reader to wonder about the specific advantages or disadvantages of this new approach.

What are the specific semiconductor devices that can benefit the most from this manufacturing method?

Answer: The article does not mention any specific semiconductor devices that would benefit the most from this method, leaving room for speculation on its potential applications in different industries.

Original Abstract Submitted

A manufacturing method of a semiconductor device includes: forming a plurality of element structures in a form of matrix on a first surface of a semiconductor wafer; forming a crack extending in a thickness direction of the semiconductor wafer along a boundary between the element structures adjacent to each other by pressing a pressing member against a second surface of the semiconductor wafer opposite to the first surface along the boundary; and dividing the semiconductor wafer along the boundary by pressing a dividing member against the semiconductor wafer on a first surface side along the boundary.