18489493. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SeungRyong Oh of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18489493 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package consists of a lower package and an upper package on top of the lower package. The lower package contains a first substrate, chip stacks, a first mold structure, and a second substrate.
- The chip stacks consist of a first semiconductor chip and a second semiconductor chip stacked on top of each other.
- The first semiconductor chip includes a first semiconductor substrate, a first wiring layer with wiring patterns, a first circuit layer with a transistor and circuit wirings, and a chip through electrode.
- The height of the chip through electrode ranges from 2 μm to 50 μm.
Potential Applications: This technology can be used in various electronic devices such as smartphones, tablets, and computers. It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: This technology addresses the need for compact and efficient semiconductor packaging. It solves the challenge of integrating multiple semiconductor chips in a small space while maintaining performance.
Benefits: Improved performance and efficiency in electronic devices. Reduced size and weight of semiconductor packages. Enhanced reliability and durability of semiconductor components.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be utilized by semiconductor manufacturers to produce high-performance electronic devices. It has implications in the consumer electronics market, automotive industry, and healthcare sector.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the performance of electronic devices?
- This technology enhances device performance by enabling compact and efficient semiconductor packaging, leading to improved functionality and reliability.
2. What are the potential challenges in implementing this advanced semiconductor packaging technology?
- Some challenges may include ensuring proper alignment of the chip stacks, managing heat dissipation, and optimizing the manufacturing process for mass production.
Original Abstract Submitted
A semiconductor package includes a lower package and an upper package on the lower package. The lower package includes a first substrate, chip stacks on the first substrate, a first mold structure on the first substrate that covers the chip stacks, and a second substrate on the first mold structure. The chip stacks include a first semiconductor chip and a second semiconductor chip on the first semiconductor chip. The first semiconductor chip includes a first semiconductor substrate, a first wiring layer adjacent the first semiconductor substrate and including wiring patterns, a first circuit layer on the first semiconductor substrate and including a transistor and circuit wirings connected to the transistor, and a chip through electrode penetrating at least a portion of the first circuit layer and the first semiconductor substrate and a height of the chip through electrode ranges from 2 μm to 50 μm.
