18489422. ENCAPSULATING ELECTRONICS ON FLEXIBLE FLUOROELASTOMER SUBSTRATES simplified abstract (Saudi Arabian Oil Company)
Contents
ENCAPSULATING ELECTRONICS ON FLEXIBLE FLUOROELASTOMER SUBSTRATES
Organization Name
Inventor(s)
Sahil P. Wankhede of Boston MA (US)
Keith William Brashler of Dhahran (SA)
Mohammad Al-ba’adani of Jeddah (SA)
Doru Catalin Turcan of Dhahran (SA)
ENCAPSULATING ELECTRONICS ON FLEXIBLE FLUOROELASTOMER SUBSTRATES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18489422 titled 'ENCAPSULATING ELECTRONICS ON FLEXIBLE FLUOROELASTOMER SUBSTRATES
The method described in the patent application involves treating a flexible fluoroelastomer substrate to increase its surface energy, printing a layer of conductive material onto the substrate using an inkjet printer, and applying an encapsulant layer made of a fluoroelastomer onto the substrate.
- Treatment of flexible fluoroelastomer substrate to increase surface energy
- Printing of conductive material layer with an inkjet printer
- Application of encapsulant layer made of fluoroelastomer onto the substrate
Potential Applications: - Flexible electronic components - Wearable technology - Biomedical devices
Problems Solved: - Enhancing flexibility and durability of electronic components - Improving adhesion of conductive materials on flexible substrates
Benefits: - Increased reliability and performance of flexible electronic components - Enhanced resistance to environmental factors such as moisture and temperature changes
Commercial Applications: Title: "Flexible Electronic Components for Wearable Technology and Biomedical Devices" This technology can be used in the development of wearable devices, medical sensors, and other flexible electronics for various commercial applications.
Prior Art: There is no information provided on prior art related to this specific technology.
Frequently Updated Research: There is ongoing research in the field of flexible electronics and materials science that may be relevant to the development and improvement of this technology.
Questions about the technology: 1. How does the treatment of the fluoroelastomer substrate impact the adhesion of the conductive material? 2. What are the potential challenges in scaling up the production of flexible electronic components using this method?
Original Abstract Submitted
A method of forming a flexible electronic component includes treating a flexible fluoroelastomer substrate to increase the surface energy of the substrate to a specified surface energy. After the treatment, a layer of conductive material is printed with an inkjet printer onto the substrate. After the printing, an encapsulant layer comprising a fluoroelastomer is applied onto the substrate.
