18489354. SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
Organization Name
Inventor(s)
Seunghak Park of Suwon-si (KR)
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18489354 titled 'SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
The semiconductor device described in the abstract consists of multiple stack structures and channel structures connected to each other, as well as various mold structures and overlay structures.
- The device includes a first stack structure in a first region, with subsequent stack structures and channel structures in contact with each other.
- Mold structures and overlay structures are also present in different regions of the device.
- The overlay structures are located on an overlay mark region, specifically in quadrants within that region.
Potential Applications: - This technology could be used in the manufacturing of advanced semiconductor devices for various electronic applications. - It may find applications in the development of high-performance computing systems and integrated circuits.
Problems Solved: - The technology addresses the need for complex and efficient semiconductor devices with multiple stack and channel structures. - It provides a solution for precise alignment and overlay of structures within the device.
Benefits: - Improved performance and functionality of semiconductor devices. - Enhanced precision and alignment of different structures within the device. - Potential for increased efficiency and reliability in electronic applications.
Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Performance This technology could be utilized in the production of cutting-edge electronic devices, such as smartphones, tablets, and computers, to improve their overall performance and functionality.
Questions about the technology: 1. How does the alignment of overlay structures impact the overall performance of the semiconductor device? 2. What are the potential challenges in manufacturing semiconductor devices with multiple stack and channel structures?
Original Abstract Submitted
A semiconductor device includes a first stack structure in a first region, a first channel structure in contact with the substrate, a second stack structure on the first stack structure, a second channel structure connected to the first channel structure, a third stack structure on the second stack structure, a third channel structure connected to the second channel structure, a first mold structure in a second region, first overlay structures on the first mold structure, a second mold structure on the first mold structure, second overlay structures on the second mold structure, a third mold structure on the second mold structure, and third overlay structures on the third mold structure, wherein the first to third overlay structures are on an overlay mark region, and the first to third overlay structures are in at least one of quadrants in the overlay mark region.
