18486831. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGES
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Sun Kyoung Seo of Suwon-si (KR)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18486831 titled 'SEMICONDUCTOR PACKAGES
Simplified Explanation
The semiconductor package described in the abstract includes a first semiconductor chip extending in two intersecting directions, a second semiconductor chip on top of the first chip in a perpendicular direction, and a bump structure with a conductive material layer between the chips. The second chip has two areas, with bump structures overlapping each area at different thicknesses.
- First semiconductor chip extending in two intersecting directions
- Second semiconductor chip on top of the first chip in a perpendicular direction
- Bump structure with a conductive material layer between the chips
- Two areas on the second chip, with bump structures of different thicknesses overlapping each area
Potential Applications
The technology described in this patent application could be applied in:
- Advanced semiconductor packaging
- High-performance electronic devices
Problems Solved
This technology helps in:
- Improving signal transmission between semiconductor chips
- Enhancing the overall performance of electronic devices
Benefits
The benefits of this technology include:
- Increased efficiency in data processing
- Enhanced reliability of semiconductor packages
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Telecommunications industry
Possible Prior Art
One possible prior art for this technology could be:
- Existing semiconductor packaging techniques with similar bump structures and conductive material layers
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods?
This technology offers improved signal transmission and performance compared to traditional methods by utilizing different thicknesses of bump structures.
What are the specific dimensions and materials used in the bump structures and conductive material layer?
The abstract does not provide specific details on the dimensions and materials used in the bump structures and conductive material layer.
Original Abstract Submitted
A semiconductor package comprising: a first semiconductor chip extending in each of first and second directions that intersect each other; a second semiconductor chip on the first semiconductor chip in a third direction perpendicular to the first and second directions, wherein the second semiconductor chip includes a first area and a second area that is adjacent to and extends around the first area; and a bump structure and a conductive material layer between the first and second semiconductor chips, wherein the conductive material layer is on the bump structure, wherein the bump structure includes a first bump structure overlapping the first area in the third direction, and a second bump structure overlapping the second area in the third direction, wherein the first and second bump structures are spaced apart from each other, and a thickness of the second bump structure is larger than a thickness of the first bump structure.
