18486574. WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Joungeun Yoo of Seongnam-si (KR)

Youngjae Kang of Suwon-si (KR)

Duseop Yoon of Seongnam-si (KR)

WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18486574 titled 'WIRING MATERIAL FOR SEMICONDUCTOR DEVICE, WIRING FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE WIRING

Simplified Explanation

The abstract of the patent application describes a wiring material for a semiconductor device, which includes a boride-based compound containing boron and at least one metal selected from elements of Groups 2 to 14. It also mentions a wiring for a semiconductor device and a semiconductor device itself that includes the wiring material.

  • The patent application describes a wiring material for a semiconductor device.
  • The wiring material contains a boride-based compound with boron and at least one metal from Groups 2 to 14.
  • The patent application also includes a wiring for a semiconductor device that uses the same wiring material.
  • Furthermore, a semiconductor device is described, which includes the wiring containing the wiring material.

Potential applications of this technology:

  • This wiring material can be used in various semiconductor devices, such as integrated circuits, microprocessors, and memory chips.
  • It can be applied in electronic devices like smartphones, computers, and tablets.

Problems solved by this technology:

  • The boride-based compound in the wiring material enhances the electrical conductivity and thermal stability of the wiring.
  • The inclusion of boron and metals from Groups 2 to 14 improves the overall performance and reliability of the semiconductor device.

Benefits of this technology:

  • The improved electrical conductivity allows for faster and more efficient data transfer within the semiconductor device.
  • The enhanced thermal stability ensures that the wiring can withstand high temperatures without degradation.
  • The overall performance and reliability of the semiconductor device are improved, leading to better functionality and longevity.


Original Abstract Submitted

Provided are a wiring material for a semiconductor device, the wiring material including a boride-based compound containing boron and at least one metal selected from elements of Groups 2 to 14, a wiring for a semiconductor device including the same, and a semiconductor device including the wiring containing the wiring material.

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