18485953. SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED METHODS FOR THEIR PRODUCTION simplified abstract (Infineon Technologies AG)
Contents
SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED METHODS FOR THEIR PRODUCTION
Organization Name
Inventor(s)
Martin Mayer of Nittendorf (DE)
Rainer Markus Schaller of Aichen (DE)
SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED METHODS FOR THEIR PRODUCTION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18485953 titled 'SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED METHODS FOR THEIR PRODUCTION
The semiconductor device described in the patent application consists of a chip carrier, a semiconductor chip, an intermediate layer, and an encapsulation material.
- Filler particles embedded in either the intermediate layer or the encapsulation material contain a semiconductor material with a band gap ranging from 2.3 eV to 3.6 eV.
- The semiconductor chip is at least partially encapsulated by the encapsulation material.
- The inclusion of filler particles with specific semiconductor material properties enhances the performance and functionality of the semiconductor device.
- This innovation aims to improve the efficiency and reliability of semiconductor devices by utilizing filler particles with tailored semiconductor properties.
- The technology described in the patent application could lead to advancements in the semiconductor industry by enhancing the performance of semiconductor devices.
Potential Applications: The technology could be applied in various electronic devices such as smartphones, computers, and IoT devices.
Problems Solved: Enhances the efficiency and reliability of semiconductor devices by utilizing filler particles with specific semiconductor properties.
Benefits: Improved performance and functionality of semiconductor devices, leading to enhanced user experience and reliability.
Commercial Applications: The technology could be utilized in the production of consumer electronics, industrial equipment, and automotive systems to improve overall performance and reliability.
Questions about the technology: 1. How does the inclusion of filler particles with specific semiconductor properties impact the performance of semiconductor devices? 2. What potential advancements could this technology bring to the semiconductor industry?
Original Abstract Submitted
A semiconductor device contains a chip carrier and a semiconductor chip arranged on the chip carrier. Furthermore, the semiconductor device comprises an intermediate layer arranged between the chip carrier and the semiconductor chip, and an encapsulation material at least partially encapsulating the semiconductor chip. Filler particles are embedded in at least one of the interlayer or the encapsulation material, wherein the filler particles contain a semiconductor material with a band gap in a range from 2.3 eV to 3.6 eV.
