18485745. METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE simplified abstract (NICHIA CORPORATION)

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METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE

Organization Name

NICHIA CORPORATION

Inventor(s)

Koji Nishino of Tokushima-shi (JP)

Yoshinori Kashima of Anan-shi (JP)

Noriyuki Nakashima of Anan-shi (JP)

Kenta Nishii of Tokushima-shi (JP)

Masaki Nagao of Anan-shi (JP)

METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18485745 titled 'METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE

Simplified Explanation

The method described in the patent application involves manufacturing a light-emitting device by preparing a substrate with light-emitting elements, covering them with a light-transmissive member, pressing the corners of the member to make contact with the substrate, and then curing the member.

  • Substrate prepared with light-emitting elements
  • Light-transmissive member with rectangular shape in plan view
  • Pressing corners of the member to make contact with the substrate
  • Curing the light-transmissive member after pressing

Potential Applications

The technology described in this patent application could be applied in the manufacturing of various types of light-emitting devices, such as LED displays, lighting fixtures, and electronic signage.

Problems Solved

This method solves the problem of ensuring proper alignment and contact between the light-transmissive member and the substrate, which is crucial for the performance and durability of the light-emitting device.

Benefits

The benefits of this technology include improved efficiency in manufacturing light-emitting devices, enhanced durability and performance of the devices, and potentially reduced production costs.

Potential Commercial Applications

"Manufacturing Process for Light-Emitting Devices: Applications and Benefits"

Possible Prior Art

There may be prior art related to methods for manufacturing light-emitting devices using similar techniques, but specific examples are not provided in the abstract.

Unanswered Questions

How does this method compare to traditional techniques for manufacturing light-emitting devices?

This article does not provide a direct comparison between this method and traditional techniques for manufacturing light-emitting devices. It would be interesting to know if this method offers any significant advantages in terms of efficiency, cost, or performance.

Are there any limitations or drawbacks to using this method for manufacturing light-emitting devices?

The abstract does not mention any limitations or drawbacks of this method. It would be important to understand if there are any potential challenges or constraints associated with implementing this manufacturing process in real-world production settings.


Original Abstract Submitted

A method for manufacturing the light-emitting device includes: preparing a substrate including a plurality of light-emitting elements disposed in an element placement region of the substrate that is on an upper surface; disposing a light-transmissive member to cover the plurality of light-emitting elements, the light-transmissive member having a rectangular shape in a plan view and being uncured, and pressing one or more corner regions of the light-transmissive member, such that a part of a lower surface of the light-transmissive member is in contact with the upper surface of the substrate outside the element placement region; and curing the light-transmissive member after pressing the one or more corner regions.