18485378. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18485378 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation:
This patent application describes a semiconductor package that includes a first semiconductor chip, a connection die next to the first chip, and a second semiconductor chip on top of the first chip and the connection die. The first chip has first through electrodes, while the connection die has second through electrodes. The first and second through electrodes are positioned below and vertically overlap the second semiconductor chip.
- The semiconductor package includes a first semiconductor chip, a connection die, and a second semiconductor chip.
- The first chip has first through electrodes, and the connection die has second through electrodes.
- The first and second through electrodes are positioned below and vertically overlap the second semiconductor chip.
Key Features and Innovation:
- Integration of multiple semiconductor chips in a single package.
- Use of through electrodes for vertical connectivity.
- Efficient stacking of semiconductor components.
Potential Applications:
- High-density memory modules.
- Advanced computing systems.
- Compact electronic devices.
Problems Solved:
- Limited space for multiple semiconductor chips.
- Complex interconnection between chips.
- Heat dissipation issues in densely packed devices.
Benefits:
- Increased performance in compact devices.
- Enhanced data processing capabilities.
- Improved thermal management.
Commercial Applications:
The technology described in this patent application has potential commercial applications in the development of high-performance computing systems, compact consumer electronics, and advanced memory modules. The ability to stack multiple semiconductor chips efficiently can lead to the creation of more powerful and compact devices, catering to the growing demand for smaller yet more powerful electronics in various industries.
Questions about Semiconductor Package Technology:
1. How does the integration of multiple semiconductor chips in a single package improve device performance? 2. What are the key advantages of using through electrodes for vertical connectivity in semiconductor packaging?
Original Abstract Submitted
A semiconductor package includes a first semiconductor chip, a connection die adjacent a side surface of the first semiconductor chip, and a second semiconductor chip on the first semiconductor chip and the connection die. The first semiconductor chip includes a plurality of first through electrodes. The connection die includes a plurality of second through electrodes. The first through electrodes and the second through electrodes are below and vertically overlap the second semiconductor chip.
