18483870. CIRCUIT MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
Contents
- 1 CIRCUIT MODULE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CIRCUIT MODULE - A simplified explanation of the abstract
- 1.4 Potential Applications
- 1.5 Problems Solved
- 1.6 Benefits
- 1.7 Commercial Applications
- 1.8 Prior Art
- 1.9 Frequently Updated Research
- 1.10 Questions about the Technology
- 1.11 Original Abstract Submitted
CIRCUIT MODULE
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Yoshihito Otsubo of Nagaokakyo-shi (JP)
CIRCUIT MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18483870 titled 'CIRCUIT MODULE
The patent application describes a structure where a sealing resin is placed between two main surfaces, with circuit board mounting electrodes on each surface. A component is mounted on one of the electrodes and enclosed in the sealing resin. A heat conduction member overlaps the component and is connected to a conductor layer on the circuit board.
- Sealing resin is used to encapsulate components for protection.
- Circuit board mounting electrodes provide secure attachment points.
- Heat conduction member helps dissipate heat from the component.
- Conductor layer facilitates heat transfer between the component and the circuit board.
Potential Applications
This technology could be used in electronic devices where heat dissipation and component protection are crucial, such as in smartphones, laptops, and industrial equipment.
Problems Solved
This innovation addresses the challenges of heat management and component protection in electronic devices, ensuring optimal performance and longevity.
Benefits
The technology enhances the reliability and durability of electronic devices by improving heat dissipation and safeguarding components from external factors.
Commercial Applications
The technology can be applied in the consumer electronics industry, as well as in industrial settings where electronic equipment is exposed to harsh conditions.
Prior Art
There may be existing patents or technologies related to heat dissipation and component protection in electronic devices, but this specific combination of features could be unique.
Frequently Updated Research
Ongoing research in materials science and electronics manufacturing may lead to advancements in heat dissipation and component protection technologies, potentially impacting the development of this innovation.
Questions about the Technology
Question 1
How does the heat conduction member contribute to the overall performance of the electronic device?
Question 2
What are the potential challenges in implementing this technology on a larger scale in industrial applications?
Original Abstract Submitted
A first sealing resin is disposed between a first lower main surface and a second upper main surface. An upper circuit board first mounting electrode is disposed on the first lower main surface. A lower circuit board first mounting electrode is disposed on the second upper main surface. A first component is mounted on the lower circuit board first mounting electrode and is disposed in the first sealing resin. A first conductor layer is disposed on an upper circuit board. As viewed in the downward direction, a heat conduction member overlaps the first component, is disposed in a space between the first lower main surface and the second upper main surface, and is coupled to the first conductor layer via a conductor. A part of a heat dissipation member is exposed from the first sealing resin in a direction orthogonal to an up-down axis.
