18483748. SEMICONDUCTOR DEVICE HAVING CONTACT PLUG simplified abstract (MICRON TECHNOLOGY, INC.)
Contents
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
Organization Name
Inventor(s)
TAKAYOSHI Tashiro of Higashihiroshima (JP)
HIROKI Yamawaki of Higashihiroshima (JP)
AKIRA Kaneko of Higashihiroshima (JP)
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG - A simplified explanation of the abstract
This abstract first appeared for US patent application 18483748 titled 'SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
The patent application describes an apparatus with a unique structure for connecting conductive patterns in semiconductor devices.
- The apparatus includes a first interlayer insulating film with a contact hole, a contact plug embedded in the contact hole, a barrier metal part within the contact plug, a second interlayer insulating film covering the first film, and a conductive pattern embedded in the second film.
- A portion of the second insulating film is embedded in the gap between the outer wall of the contact plug and the inner wall of the contact hole, providing enhanced connectivity.
- The barrier metal part within the contact plug ensures proper electrical connection and prevents material diffusion.
Potential Applications: - This technology can be applied in the manufacturing of advanced semiconductor devices. - It can improve the reliability and performance of integrated circuits in various electronic devices.
Problems Solved: - Enhances the electrical connection between different layers in semiconductor devices. - Prevents material diffusion and improves the overall reliability of the device.
Benefits: - Improved electrical connectivity and reliability in semiconductor devices. - Enhanced performance and longevity of integrated circuits.
Commercial Applications: - This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and automotive electronics.
Questions about the technology: 1. How does the barrier metal part within the contact plug improve the electrical connection? 2. What are the specific advantages of embedding the second interlayer insulating film in the gap between the contact plug and the contact hole?
Original Abstract Submitted
An apparatus that includes a first interlayer insulating film having a contact hole; a contact plug embedded in the contact hole, the contact plug including a main part and a barrier metal part located between an outer wall of the main part and an inner wall of the contact hole; a second interlayer insulating film covering the first interlayer insulating film; and a first conductive pattern embedded in the second interlayer insulating film and connected to the contact plug. Apart of the second interlayer insulating film is embedded in a gap between a top part of the outer wall of the main part of the contact plug and a top part of the inner wall of the contact hole.
