18482680. INPUT/OUTPUT INTERFACE CELL, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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INPUT/OUTPUT INTERFACE CELL, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Yongeun Cho of Suwon-Si (KR)

Hyunjeong Roh of Suwon-Si (KR)

Kibum Kim of Suwon-Si (KR)

Seonkyeong Kim of Suwon-Si (KR)

Hayoung Kim of Suwon-Si (KR)

INPUT/OUTPUT INTERFACE CELL, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18482680 titled 'INPUT/OUTPUT INTERFACE CELL, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE

The semiconductor device described in the abstract consists of two I/O interface cell regions, each containing ESD diodes, drivers, and through silicon vias (TSVs) with wiring patterns and via patterns for electrical connections.

  • The first I/O interface cell region includes a plurality of first ESD diodes, a first driver, and a first TSV with wiring patterns and via patterns for connecting them.
  • The second I/O interface cell region contains a plurality of second ESD diodes, a second driver, and a second TSV with wiring patterns and via patterns for connecting a subset of the second ESD diodes, separate from the driver and TSV.

Potential Applications: - This technology could be used in various semiconductor devices requiring ESD protection and efficient electrical connections. - It may find applications in integrated circuits, microprocessors, and other electronic devices where ESD protection is crucial.

Problems Solved: - Provides effective ESD protection for semiconductor devices. - Enables efficient electrical connections within the device.

Benefits: - Enhanced reliability and durability of semiconductor devices. - Improved performance and longevity due to effective ESD protection.

Commercial Applications: Title: Semiconductor Device with Enhanced ESD Protection This technology could be valuable in the semiconductor industry for manufacturing robust and reliable electronic components with superior ESD protection, catering to a wide range of consumer electronics and industrial applications.

Prior Art: Readers interested in exploring prior art related to this technology can start by researching semiconductor device designs with ESD protection features and through silicon vias.

Frequently Updated Research: Stay updated on the latest advancements in semiconductor device technology, particularly in ESD protection methods and through silicon via integration.

Questions about Semiconductor Device with Enhanced ESD Protection: 1. How does this technology improve the reliability of semiconductor devices? - This technology enhances reliability by providing effective ESD protection and efficient electrical connections. 2. What are the potential commercial applications of a semiconductor device with enhanced ESD protection? - The technology can be applied in various electronic devices, offering superior ESD protection and improved performance.


Original Abstract Submitted

A semiconductor device includes: a first I/O interface cell region having a plurality of first electrostatic discharge (ESD) diodes, a first driver and a first through silicon via (TSV) disposed therein and having first wiring patterns and first via patterns for electrically connecting the plurality of first ESD diodes, the first driver and the first TSV; and a second I/O interface cell region having a plurality of second ESD diodes, a second driver and a second TSV disposed therein and having second wiring patterns and second via patterns for electrically connecting the second driver, the second TSV and a subset of the plurality of second ESD diodes, wherein the second ESD diodes other than the subset are separated from the second driver and the second TSV.