18482663. SEMICONDUCTOR DEVICE HAVING DIE RING CONDUCTOR simplified abstract (Micron Technology, Inc.)
Contents
SEMICONDUCTOR DEVICE HAVING DIE RING CONDUCTOR
Organization Name
Inventor(s)
Teppei Miyaji of Sagamihara (JP)
SEMICONDUCTOR DEVICE HAVING DIE RING CONDUCTOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 18482663 titled 'SEMICONDUCTOR DEVICE HAVING DIE RING CONDUCTOR
The abstract describes an apparatus with first and second circuit blocks integrated on a semiconductor chip, surrounded by a die ring conductor along the edges of the chip. One of the circuit blocks includes a die ring controller, which is coupled to the die ring conductor, while the other circuit block is isolated from it.
- The apparatus integrates first and second circuit blocks on a semiconductor chip.
- A die ring conductor surrounds the circuit blocks along the edges of the chip.
- One circuit block includes a die ring controller, which is connected to the die ring conductor.
- The other circuit block is isolated from the die ring conductor.
- This setup allows for efficient control and communication within the semiconductor chip.
Potential Applications: - Integrated circuits - Semiconductor technology - Electronic devices
Problems Solved: - Efficient communication and control within a semiconductor chip - Enhanced integration of circuit blocks
Benefits: - Improved performance of electronic devices - Enhanced functionality of integrated circuits
Commercial Applications: Title: Semiconductor Chip Integration Technology for Enhanced Performance This technology can be applied in various industries such as telecommunications, consumer electronics, and automotive for improved efficiency and performance of electronic devices.
Questions about Semiconductor Chip Integration Technology: 1. How does the die ring conductor enhance communication within the semiconductor chip? The die ring conductor allows for efficient communication between the circuit blocks on the chip, improving overall performance.
2. What are the potential drawbacks of isolating one circuit block from the die ring conductor? Isolating one circuit block may limit its ability to communicate with other components on the chip, potentially affecting overall functionality.
Original Abstract Submitted
An apparatus that includes first and second circuit blocks integrated on a semiconductor chip, and a die ring conductor provided along edges of the semiconductor chip so as to surround the first and second circuit blocks. The first circuit block includes a first die ring controller. The second circuit block includes a second die ring controller. One of the first and second die ring controllers is coupled to the die ring conductor such that another of the first and second die ring controllers is isolated from the die ring conductor.
