18481975. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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PACKAGE STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Wei-Hung Lin of Hsinchu County (TW)

Hui-Min Huang of Taoyuan City (TW)

Chang-Jung Hsueh of Taipei (TW)

Wan-Yu Chiang of Hsinchu (TW)

Ming-Da Cheng of Taoyuan City (TW)

Mirng-Ji Lii of Hsinchu County (TW)

PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18481975 titled 'PACKAGE STRUCTURE

Simplified Explanation

The abstract describes a method of forming a package structure by cutting a first package into multiple second packages and removing a specific die from one of the second packages. This results in a polygonal structure with at least 5 nodes.

  • The method involves providing a package with multiple first dies and second dies.
  • The first package is then cut into multiple second packages using a sawing process.
  • One of the second packages contains three first dies and one second die.
  • The second die is removed from the specific second package through a second sawing process.
  • The resulting cut second package forms a polygonal structure with at least 5 nodes.

Potential Applications:

  • Semiconductor manufacturing: This method can be used in the production of semiconductor devices, where the package structure plays a crucial role in protecting and connecting the dies.
  • Electronics industry: The polygonal structure formed by this method can be utilized in various electronic devices, such as smartphones, tablets, and computers.

Problems Solved:

  • Efficient packaging: The method allows for the formation of a package structure with a higher number of nodes, which can enhance the stability and connectivity of the packaged dies.
  • Space optimization: By cutting the first package into smaller second packages, space utilization can be optimized, allowing for more efficient use of manufacturing resources.

Benefits:

  • Improved structural integrity: The polygonal structure formed by this method provides increased stability and strength to the package, reducing the risk of damage during handling and transportation.
  • Enhanced connectivity: The higher number of nodes in the package structure allows for improved electrical connectivity between the dies, leading to better overall performance of the packaged device.
  • Cost-effective manufacturing: By optimizing space utilization and reducing material waste, this method can contribute to cost savings in the manufacturing process.


Original Abstract Submitted

Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.

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