18481648. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Fumihito Kawahara of Tokyo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18481648 titled 'SEMICONDUCTOR DEVICE
The patent application describes a technique to prevent peeling of a sealing resin used to seal a semiconductor element.
- The semiconductor device includes an insulating substrate with a front surface metal pattern, a semiconductor element mounted on the metal pattern, a wiring wire connected to the semiconductor element, and a sealing resin that seals the substrate and the element.
- At least one metal wire is arranged around the semiconductor element on the metal pattern, with a distance greater than the thickness of the semiconductor element.
Potential Applications:
- This technology can be applied in the manufacturing of semiconductor devices to improve their reliability and longevity.
Problems Solved:
- The innovation addresses the issue of peeling of sealing resin in semiconductor devices, which can lead to malfunctions and reduced performance.
Benefits:
- Enhanced reliability and durability of semiconductor devices.
- Improved performance and longevity of electronic components.
Commercial Applications:
- This technology can be utilized in the production of various electronic devices, such as smartphones, computers, and automotive electronics.
Questions about the technology: 1. How does the distance between the semiconductor element and the metal wire prevent peeling of the sealing resin?
- The distance ensures that the metal wire does not exert pressure on the semiconductor element, reducing the risk of peeling.
2. What are the specific materials used in the sealing resin to enhance its adhesion properties?
- The patent application does not specify the exact materials used in the sealing resin, but further research in materials science could provide insights into this aspect.
Original Abstract Submitted
An object is to provide a technique that suppresses peeling of a sealing resin that seals a semiconductor element by a simple method. A semiconductor device includes an insulating substrate provided with a front surface metal pattern a front surface thereof, a semiconductor element mounted on the front surface metal pattern, a wiring wire connected to the front surface electrode of the semiconductor element, a sealing resin that seals the insulating substrate and the semiconductor element, and at least one metal wire arranged around the semiconductor elements on and along the front surface metal pattern. The distance between the semiconductor element and the at least one metal wire is greater than the thickness of the semiconductor element.
