18479716. LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME simplified abstract (CANON KABUSHIKI KAISHA)
Contents
- 1 LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
TOMOAKI Kamagata of Kanagawa (JP)
TAKASHI Hayasaka of Kanagawa (JP)
SATOSHI Ideta of Kanagawa (JP)
LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18479716 titled 'LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME
Simplified Explanation
The liquid ejection head described in the patent application includes an element substrate, an electric wiring board, a cover member, and a support member with specific features and functions:
- Element substrate with ejection port and pressure chamber for liquid supply
- Cover member joined to support surface with first adhesive
- Support member with first and second through holes, supporting element substrate and wiring board
- First through hole as flow passage for liquid supply, second through hole opening in support surface
- First adhesive in outer peripheral region of support surface
- Space surrounded by cover member, support member, and first adhesive communicates with second through hole
Potential Applications
The technology described in the patent application could be applied in various industries such as:
- Inkjet printing
- Biomedical research
- Pharmaceutical manufacturing
Problems Solved
This technology addresses several issues, including:
- Efficient liquid supply to ejection port
- Secure attachment of cover member to support surface
- Proper support for element substrate and wiring board
Benefits
The liquid ejection head offers the following benefits:
- Improved liquid ejection performance
- Enhanced durability and reliability
- Simplified assembly process
Potential Commercial Applications
The technology could be utilized in commercial products such as:
- Desktop printers
- Laboratory equipment
- Industrial printing machines
Possible Prior Art
One possible prior art for this technology could be the design of liquid ejection heads in existing inkjet printers, which may have similar features and functions.
Unanswered Questions
How does this technology compare to existing liquid ejection heads in terms of performance and efficiency?
The article does not provide a direct comparison with existing liquid ejection heads in terms of performance and efficiency. Further research and testing would be needed to determine the specific advantages of this technology over existing solutions.
What are the potential limitations or drawbacks of implementing this technology in practical applications?
The article does not mention any potential limitations or drawbacks of implementing this technology in practical applications. Additional studies and real-world testing may be necessary to identify any challenges or issues that could arise during implementation.
Original Abstract Submitted
A liquid ejection head includes an element substrate, an electric wiring board, a cover member, and a support member having a first through hole, a second through hole, and a support surface. The element substrate includes an ejection port and a pressure chamber to supply liquid to the ejection port. The cover member is joined to the support surface with a first adhesive. The support member supports the element substrate and the electric wiring board on the support surface. The first through hole serves as a flow passage through which the liquid is supplied to the pressure chamber and the second through hole opens in the support surface. The first adhesive is disposed in an outer peripheral region of the support surface of the support member. A space surrounded by the cover member, the support member, and the first adhesive communicates with the second through hole.
