18477992. AMPLIFIER MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
Contents
- 1 AMPLIFIER MODULE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 AMPLIFIER MODULE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
AMPLIFIER MODULE
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Kenichi Shimamoto of Kyoto (JP)
AMPLIFIER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18477992 titled 'AMPLIFIER MODULE
Simplified Explanation
The amplifier module described in the patent application includes a first preamplifier, first postamplifier, second postamplifier, output balun, and a variable capacitance element to amplify and output a differential signal.
- The first preamplifier is located on a first substrate and amplifies the input signal.
- The first postamplifier and second postamplifier, on a second substrate, receive the output of the first preamplifier and output a differential signal.
- The output balun receives the differential signal from the postamplifiers and includes a primary winding and a secondary winding.
- The variable capacitance element is connected in parallel with the primary winding of the output balun.
Potential Applications
This technology could be used in:
- High-frequency communication systems
- Signal processing equipment
- Audio amplifiers
Problems Solved
- Improved signal amplification and output
- Enhanced performance in high-frequency applications
Benefits
- Higher quality signal amplification
- Increased efficiency in signal processing
- Improved overall system performance
Potential Commercial Applications
Optimized for:
- Telecommunications industry
- Audio equipment manufacturers
- Electronics companies
Possible Prior Art
There may be prior art related to:
- Amplifier modules with similar configurations
- Signal processing components with variable capacitance elements
Unanswered Questions
How does this technology compare to existing amplifier modules in terms of performance and efficiency?
This article does not provide a direct comparison with existing amplifier modules, so it is unclear how this technology stacks up against current solutions.
Are there any limitations or drawbacks to implementing this technology in practical applications?
The article does not address any potential limitations or drawbacks that may arise when implementing this technology in real-world scenarios.
Original Abstract Submitted
An amplifier module includes an input terminal; a first preamplifier formed in or on a first substrate and configured to amplify a signal that is input to the input terminal; a first postamplifier and a second postamplifier that are formed in or on a second substrate and that are configured to receive an output of the first preamplifier and output a differential signal; an output balun configured to receive the differential signal that is output from the first postamplifier and the second postamplifier; and a variable capacitance element. The output balun includes a primary winding subjected to the differential signal and a secondary winding, and the variable capacitance element is connected in parallel with the primary winding of the output balun.
