18477910. SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR MANUFACTURING EQUIPMENT
Organization Name
Inventor(s)
SEMICONDUCTOR MANUFACTURING EQUIPMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18477910 titled 'SEMICONDUCTOR MANUFACTURING EQUIPMENT
The patent application describes semiconductor manufacturing equipment with a bonding head, a head heater with a thermal compression surface, negative pressure channels, and a bonding tool for thermal compression.
- The equipment includes a bonding head with a head heater at the bottom, featuring a thermal compression surface.
- Negative pressure channels are recessed from the thermal compression surface, with holes for functionality.
- A bonding tool has grooves on one surface to contact the thermal compression surface and another surface to contact a semiconductor chip for thermal compression.
- Key Features and Innovation:**
- Integration of a head heater with a thermal compression surface for semiconductor bonding.
- Incorporation of negative pressure channels for enhanced functionality during the bonding process.
- Design of a bonding tool with grooves for efficient thermal compression of semiconductor chips.
- Potential Applications:**
This technology can be used in the manufacturing of various semiconductor devices, such as microchips, sensors, and integrated circuits.
- Problems Solved:**
This technology addresses the need for precise thermal compression during semiconductor bonding processes, improving the overall quality and reliability of semiconductor devices.
- Benefits:**
- Enhanced bonding efficiency and accuracy.
- Improved thermal compression for semiconductor chips.
- Increased reliability and quality of semiconductor devices.
- Commercial Applications:**
This technology has potential applications in the semiconductor industry for the production of advanced electronic devices, leading to improved performance and reliability in various electronic products.
- Questions about Semiconductor Manufacturing Equipment:**
1. How does the integration of a head heater with a thermal compression surface improve semiconductor bonding processes?
- The integration of a head heater with a thermal compression surface allows for precise and efficient thermal compression during semiconductor bonding, ensuring high-quality and reliable bonding results.
2. What role do negative pressure channels play in the bonding process?
- Negative pressure channels help enhance functionality by creating a vacuum effect that aids in the bonding of semiconductor materials.
Original Abstract Submitted
Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.
