18475784. SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
Organization Name
Inventor(s)
Suk Kang Sung of Suwon-si (KR)
SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18475784 titled 'SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
The semiconductor memory device described in the abstract includes a cell substrate, a mold structure with gate electrodes, channel structures, and a cutting structure that cuts some of the gate electrodes.
- The cutting structure consists of a first portion with a line shape in one direction, a second portion with a line shape in another direction, and a zigzag shape formed by connecting the first and second portions alternately.
- The cutting structure also includes first and second side walls with points connected to the gate electrodes in corresponding channel structures.
- This innovative cutting structure allows for precise cutting of gate electrodes in the semiconductor memory device.
Potential Applications: - This technology can be applied in the manufacturing of semiconductor memory devices for various electronic devices. - It can improve the efficiency and accuracy of cutting processes in semiconductor fabrication.
Problems Solved: - Provides a solution for cutting gate electrodes in semiconductor memory devices with precision. - Enhances the overall performance and reliability of semiconductor memory devices.
Benefits: - Increased accuracy in cutting gate electrodes. - Improved functionality and performance of semiconductor memory devices. - Enhanced manufacturing processes in semiconductor fabrication.
Commercial Applications: Title: Precision Cutting Technology for Semiconductor Memory Devices This technology can be utilized in the production of memory chips for smartphones, computers, and other electronic devices, improving their performance and reliability. The market implications include increased demand for high-quality memory chips in the electronics industry.
Questions about Precision Cutting Technology for Semiconductor Memory Devices: 1. How does the cutting structure in this technology improve the manufacturing process of semiconductor memory devices? 2. What are the potential cost savings associated with implementing this precision cutting technology in semiconductor fabrication processes?
Original Abstract Submitted
A semiconductor memory device may include a cell substrate, a mold structure including gate electrodes stacked on the cell substrate, a channel structures penetrating the mold structure; and a first cutting structure cutting some of the gate electrodes. The first cutting structure may include a first portion having a line shape extending in a first direction and a second portion having a line shape extending in a second direction. The first portion and the second portion may be alternately connected to form a zigzag shape. The first cutting structure may include a first side wall and a second side wall opposing the first side wall. A first point of the first side wall connected from the second portion to the first portion and a second point of the second side wall connected from the first portion to the second portion may be in corresponding channel structures among the channel structures.
