18474158. THERMALLY AWARE STACKING TOPOLOGY simplified abstract (ADVANCED MICRO DEVICES, INC.)

THERMALLY AWARE STACKING TOPOLOGY

Organization Name

ADVANCED MICRO DEVICES, INC.

Inventor(s)

Omar Zia of Austin TX (US)

Thomas D Burd of Santa Clara CA (US)

Kevin Gillespie of Boxborough MA (US)

Samuel Naffziger of Fort Collins CO (US)

Richard Schultz of Fort Collins CO (US)

Raja Swaminathan of Austin TX (US)

Srividhya Venkataraman of Santa Clara CA (US)

Yan Wang of San Jose CA (US)

John Wuu of Fort Collins CO (US)

THERMALLY AWARE STACKING TOPOLOGY - A simplified explanation of the abstract

This abstract first appeared for US patent application 18474158 titled 'THERMALLY AWARE STACKING TOPOLOGY

Simplified Explanation

The patent application describes a method for stacking circuit dies, where a first circuit die with a metal stack is connected to a second circuit die with a metal stack, which is part of an integrated circuit.

• Method for stacking circuit dies
• First circuit die with a metal stack
• Second circuit die with a metal stack
• Connection between the first and second metal stacks
• Integrated circuit configuration

Key Features and Innovation

• Stacking circuit dies for integrated circuits
• Connecting metal stacks of different circuit dies
• Efficient thermal management
• Enhanced performance of integrated circuits
• Versatile application in various electronic devices

Potential Applications

The technology can be applied in the manufacturing of integrated circuits for:

• Mobile devices
• Computers
• Automotive electronics
• IoT devices
• Medical devices

Problems Solved

• Improved thermal management in integrated circuits
• Enhanced connectivity between circuit dies
• Increased performance and reliability of electronic devices

Benefits

• Better heat dissipation in integrated circuits
• Higher efficiency and performance of electronic devices
• Extended lifespan of electronic components
• Enhanced overall functionality of integrated circuits

Commercial Applications

Title: Advanced Circuit Die Stacking Technology for Enhanced Performance This technology can be utilized in various commercial applications such as:

• Semiconductor industry
• Consumer electronics manufacturing
• Telecommunications sector
• Automotive electronics production
• Medical device manufacturing

Prior Art

To explore prior art related to this technology, researchers can look into patents and publications in the field of semiconductor manufacturing, integrated circuit design, and thermal management in electronic devices.

Frequently Updated Research

Researchers can stay updated on advancements in circuit die stacking technology by following publications in semiconductor engineering journals, attending industry conferences, and monitoring patent filings in the field.

Questions about Circuit Die Stacking

How does circuit die stacking improve the performance of integrated circuits?

Circuit die stacking enhances performance by improving thermal management, connectivity, and overall efficiency in integrated circuits.

What are the potential challenges in implementing circuit die stacking technology?

Challenges in implementing circuit die stacking may include ensuring proper alignment, managing heat dissipation effectively, and optimizing electrical connections between stacked dies.

Original Abstract Submitted

A method for circuit die stacking can include providing a first circuit die having a first metal stack, wherein the first circuit die corresponds to a primary thermal source of an integrated circuit including the first circuit die. The method can additionally include providing a second circuit die of the integrated circuit, wherein the second circuit die has a second metal stack and is configured for connection to at least one of a package substrate or an additional die. The method can also include connecting the first metal stack to the second metal stack. Various other methods, systems, and computer-readable media are also disclosed.