18472453. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (MEDIATEK INC.)
Contents
SEMICONDUCTOR PACKAGE STRUCTURE
Organization Name
Inventor(s)
Shi-Bai Chen of Hsinchu City (TW)
Wei-Chih Chen of Hsinchu City (TW)
SEMICONDUCTOR PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18472453 titled 'SEMICONDUCTOR PACKAGE STRUCTURE
Simplified Explanation: The semiconductor package structure described in the abstract includes a capacitor substrate with redistribution structures, a through via, and a capacitor structure, along with a semiconductor die connected to the capacitor structure.
- The package structure consists of a capacitor substrate with various components for electrical connections.
- A semiconductor die is placed on top of the capacitor substrate and connected to the capacitor structure.
- The capacitor substrate has redistribution structures on both surfaces, connected by a through via.
- The capacitor structure is positioned between the redistribution structures and is electrically coupled to the semiconductor die.
Key Features and Innovation:
- Integration of a capacitor substrate with redistribution structures and a through via for enhanced electrical connections.
- Placement of a capacitor structure within the substrate to improve electrical coupling with the semiconductor die.
Potential Applications: This technology could be used in various semiconductor devices requiring efficient electrical connections and capacitor integration.
Problems Solved:
- Improved electrical connectivity within semiconductor packages.
- Enhanced capacitor integration for better performance.
Benefits:
- Enhanced electrical performance in semiconductor devices.
- Compact design for space-saving in electronic applications.
Commercial Applications: Potential commercial applications include semiconductor manufacturing, electronic devices, and integrated circuits.
Prior Art: Readers can explore prior art related to semiconductor packaging, capacitor integration, and semiconductor die connections for further research.
Frequently Updated Research: Stay updated on advancements in semiconductor packaging technology, capacitor integration methods, and semiconductor die connections for the latest developments in the field.
Questions about Semiconductor Package Structure: 1. What are the key components of the semiconductor package structure described in the abstract? 2. How does the capacitor substrate improve electrical connections in semiconductor devices?
Original Abstract Submitted
A semiconductor package structure includes a capacitor substrate and a first semiconductor die. The capacitor substrate has a first surface and a second surface opposite the first surface and includes a first redistribution structure, a second redistribution structure, a through via, and a first capacitor structure. The first redistribution structure is disposed on the first surface. The second redistribution structure is disposed on the second surface. The through via electrically couples the first redistribution structure to the second redistribution structure. The first capacitor structure is disposed between the first redistribution structure and the second redistribution structure and is electrically coupled to the second redistribution structure. The first semiconductor die is disposed over the capacitor substrate and is electrically coupled to the first capacitor structure through the second redistribution structure.
