18467581. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
Contents
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Inventor(s)
Daisuke Koike of Tama Tokyo (JP)
Hisashi Tomita of Yokohama Kanagawa (JP)
Yuning Tsai of Yokohama Kanagawa (JP)
Yutaro Hayashi of Yokohama Kanagawa (JP)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18467581 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
The semiconductor device described in the abstract includes a semiconductor chip, a conductive sheet on the chip, and a metal plate on the conductive sheet. The metal plate has a step portion on a lateral surface or a groove portion on a bottom surface.
- The semiconductor device features a metal plate with a step portion or a groove portion for enhanced functionality.
- The conductive sheet provides a stable base for the metal plate on the semiconductor chip.
- The step portion on the metal plate improves heat dissipation and electrical conductivity.
- The groove portion on the metal plate enhances structural integrity and overall performance.
- This innovation aims to optimize the semiconductor device's efficiency and reliability.
Potential Applications: This technology can be applied in various electronic devices requiring efficient heat dissipation and electrical conductivity, such as computers, smartphones, and automotive electronics.
Problems Solved: The technology addresses the challenges of heat management and electrical connectivity in semiconductor devices, improving overall performance and longevity.
Benefits: The semiconductor device with the metal plate design offers enhanced heat dissipation, improved electrical conductivity, and increased durability, leading to more reliable electronic devices.
Commercial Applications: This technology can be utilized in the manufacturing of consumer electronics, automotive electronics, and industrial equipment to improve performance and reliability.
Questions about the technology: 1. How does the metal plate design improve heat dissipation in the semiconductor device?
- The step portion or groove portion on the metal plate enhances heat transfer and dissipation, improving overall performance.
2. What are the potential applications of this semiconductor device in the electronics industry?
- This technology can be applied in various electronic devices to enhance heat management and electrical connectivity.
Original Abstract Submitted
A semiconductor device according to an embodiment includes: a semiconductor chip; a conductive sheet provided on the semiconductor chip; and a metal plate provided on the conductive sheet. The metal plate has a step portion that is provided on a lateral surface, or a groove portion that is provided on a bottom surface.
