18467199. BONDING SEMICONDUCTOR DEVICE, AND CHIP FOR BONDING SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
BONDING SEMICONDUCTOR DEVICE, AND CHIP FOR BONDING SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Organization Name
Inventor(s)
Kwangjin Moon of Suwon-si (KR)
BONDING SEMICONDUCTOR DEVICE, AND CHIP FOR BONDING SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18467199 titled 'BONDING SEMICONDUCTOR DEVICE, AND CHIP FOR BONDING SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Simplified Explanation: The bonding semiconductor device described in the patent application involves bonding a first chip and a second chip, with a chip region and a partition region. A bonding pad is formed by bonding corresponding pads from each chip in the chip region, while a separation pattern portion in the partition region separates base layers of different pattern portions.
- The device is formed by bonding two chips together, creating a chip region and a partition region.
- A bonding pad is created in the chip region by bonding specific pads from each chip.
- The partition region features a separation pattern portion that completely separates base layers of different pattern portions within the chips.
Potential Applications: 1. Semiconductor manufacturing 2. Electronics industry 3. Integrated circuit production
Problems Solved: 1. Efficient bonding of semiconductor chips 2. Enhanced chip performance 3. Improved manufacturing processes
Benefits: 1. Increased chip reliability 2. Enhanced electrical connectivity 3. Streamlined manufacturing processes
Commercial Applications: The technology described in the patent application could revolutionize the semiconductor industry by improving chip bonding processes, leading to more reliable and efficient electronic devices. This innovation has the potential to impact various sectors, including consumer electronics, telecommunications, and automotive industries.
Prior Art: Prior research in semiconductor bonding techniques and chip integration methods may provide valuable insights into the development of this technology. Researchers can explore existing patents and academic publications in the field of semiconductor manufacturing and integrated circuit design.
Frequently Updated Research: Researchers and industry experts are continually exploring new methods and materials for semiconductor bonding to enhance chip performance and reliability. Stay updated on the latest advancements in semiconductor manufacturing and integrated circuit technologies to leverage the full potential of this innovation.
Questions about Bonding Semiconductor Devices: 1. What are the key challenges in semiconductor chip bonding processes, and how does this technology address them? 2. How does the separation pattern portion in the partition region contribute to the overall performance of the bonding semiconductor device?
Original Abstract Submitted
A bonding semiconductor device according to at least one embodiment is formed by bonding a first chip and a second chip, and includes a chip region and a partition region. A bonding pad formed by bonding a first bonding pad of the first chip and a second bonding pad of the second chip may be provided in the chip region. A separation pattern portion in which a first base layer of a first pattern portion of the first chip and a second base layer of a second pattern portion of the second chip are entirely separated from each other to have an inner space may be provided in the partition region.
