18466941. DEPOSITION MASK simplified abstract (Samsung Display Co., LTD.)
Contents
- 1 DEPOSITION MASK
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DEPOSITION MASK - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
DEPOSITION MASK
Organization Name
Inventor(s)
SEUNGPYO Hong of Yongin-si (KR)
DEPOSITION MASK - A simplified explanation of the abstract
This abstract first appeared for US patent application 18466941 titled 'DEPOSITION MASK
Simplified Explanation
The deposition mask described in the patent application includes three portions: a first portion with an upper surface, a second portion half-etched to a first depth from the upper surface of the first portion, and a third portion half-etched to a second depth from the upper surface of the second portion. The third portion defines an opening corresponding to the pattern to be formed on the substrate, with an upper surface perpendicular to the thickness direction of the deposition mask.
- First portion with upper surface
- Second portion half-etched to a first depth
- Third portion half-etched to a second depth with opening for pattern
- Upper surface of the third portion perpendicular to thickness direction
Potential Applications
The deposition mask can be used in semiconductor manufacturing processes to create precise patterns on substrates during deposition.
Problems Solved
This technology solves the problem of accurately depositing materials on substrates to create specific patterns without any deviations or errors.
Benefits
The benefits of this technology include improved precision, efficiency, and reliability in creating patterns during deposition processes.
Potential Commercial Applications
One potential commercial application of this technology is in the production of microchips and other electronic devices where precise patterning is crucial for functionality.
Possible Prior Art
Prior art may include other deposition masks or patterning techniques used in semiconductor manufacturing processes.
Unanswered Questions
How does this deposition mask compare to other existing patterning methods in terms of cost-effectiveness?
The article does not provide information on the cost-effectiveness of this deposition mask compared to other existing patterning methods.
What materials can be used to manufacture this deposition mask for optimal performance?
The article does not mention the specific materials that can be used to manufacture this deposition mask for optimal performance.
Original Abstract Submitted
A deposition mask for forming a pattern on a substrate to be deposited, includes a first portion having an upper surface, a second portion having an upper surface half-etched to a first depth from the upper surface of the first portion, and a third portion having an upper surface half-etched to a second depth from the upper surface of the second portion. The third portion defines an opening corresponding to the pattern, and an upper surface of the third portion includes a plane perpendicular to a thickness direction of the deposition mask.
