18465982. BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME AND BONDING APPARATUS FOR MANUFACTURING THE SAME simplified abstract (SK hynix Inc.)
BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME AND BONDING APPARATUS FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
Byung Ho Lee of Gyeonggi-do (KR)
BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME AND BONDING APPARATUS FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18465982 titled 'BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME AND BONDING APPARATUS FOR MANUFACTURING THE SAME
The abstract describes a bonding structure involving two wafers with alignment keys, one with temporary magnetism, for bonding pads.
- Simplified Explanation:
This patent application discusses a bonding structure with two wafers, alignment keys, and bonding pads.
- Key Features and Innovation:
- First wafer with bonding pads - Second wafer with alignment keys - First alignment key with temporary magnetism - Second alignment key corresponding to the first key
- Potential Applications:
- Semiconductor manufacturing - Microelectronics assembly - MEMS devices production
- Problems Solved:
- Precise alignment during bonding - Efficient manufacturing process - Enhanced bond strength
- Benefits:
- Improved bonding accuracy - Streamlined production - Increased product reliability
- Commercial Applications:
Title: Advanced Bonding Structure for Semiconductor Manufacturing This technology can be used in the production of various semiconductor devices, enhancing alignment accuracy and overall product quality.
- Prior Art:
Readers can explore prior patents related to bonding structures in semiconductor manufacturing to understand the evolution of this technology.
- Frequently Updated Research:
Stay updated on the latest advancements in bonding structures for semiconductor devices to ensure the most efficient and reliable manufacturing processes.
Questions about Bonding Structures: 1. How does the temporary magnetism of the first alignment key improve the bonding process? The temporary magnetism helps in aligning the wafers accurately before bonding, ensuring a strong and reliable connection.
2. What are the potential challenges in implementing this bonding structure in large-scale semiconductor production? Large-scale implementation may require precise control over the alignment keys and bonding pads to maintain consistency and quality throughout the manufacturing process.
Original Abstract Submitted
A bonding structure may include a first wafer, a second wafer, at least one first alignment key and a second alignment key. The first wafer may include first bonding pads. The second wafer may include second bonding wafers bonded to the first bonding pads. The first alignment key may be provided to the first wafer. The first alignment key may have a temporary magnetism by an induced current. The second alignment key may be provided to the second wafer. The second alignment key may correspond to the first alignment key.
