18464511. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
Contents
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Naoki Yoshimatsu of Tokyo (JP)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18464511 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract consists of various components such as a heat spreader, solder layers, semiconductor element, electrodes, block, sheet, lead frames, and sealant. Here is a simplified explanation of the patent application:
- The semiconductor device includes a heat spreader for thermal management.
- It has solder layers to bond different components together.
- A semiconductor element is present with electrodes for electrical connections.
- A block is bonded to the semiconductor element.
- A sheet with insulating properties is in contact with the heat spreader.
- Lead frames are welded to the heat spreader and block.
- A sealant seals the components for protection.
- Potential Applications
The technology described in this patent application could be applied in various electronic devices requiring efficient thermal management and electrical connections, such as computer processors, power electronics, and LED lighting systems.
- Problems Solved
This technology solves the problem of heat dissipation in semiconductor devices, ensuring optimal performance and reliability. It also addresses the need for secure electrical connections and insulation in electronic components.
- Benefits
The benefits of this technology include improved thermal efficiency, enhanced electrical connectivity, increased reliability, and overall performance of semiconductor devices.
- Potential Commercial Applications
The semiconductor device described in this patent application has potential commercial applications in industries such as electronics manufacturing, automotive, aerospace, and telecommunications. The technology can be utilized in a wide range of products requiring high-performance semiconductor components.
- Possible Prior Art
One possible prior art for this technology could be similar semiconductor devices with heat spreaders, solder layers, and insulating materials for thermal management and electrical connections. Research on advanced packaging techniques in the semiconductor industry may also reveal related prior art.
- Unanswered Questions
- How does the efficiency of thermal management compare to existing solutions in the market?
The article does not provide specific data or comparisons with existing thermal management solutions, leaving the reader to wonder about the performance advantages of this technology.
- Are there any specific environmental benefits associated with the use of this semiconductor device?
The potential environmental impact or sustainability aspects of this technology are not addressed in the article, leaving a gap in understanding its eco-friendly attributes.
Original Abstract Submitted
The semiconductor device includes: a heat spreader; a first solder layer; a second solder layer; a semiconductor element including a first surface bonded to the heat spreader through the first solder layer, a second surface facing the first surface, a first electrode disposed on the first surface, and a second electrode disposed on the second surface; a block bonded to the second electrode through the second solder layer; a sheet including a first portion, and a second portion having insulating properties and being in contact with the heat spreader; a first lead frame welded to the heat spreader; a second lead frame welded to the block; and a sealant having insulating properties and sealing the first and second lead frames, the heat spreader, the first and second solder layers, the semiconductor element, and the block.
