18464497. LOW STRESS PACKAGING FOR ENVIRONMENTAL SENSORS (NXP USA, Inc.)
LOW STRESS PACKAGING FOR ENVIRONMENTAL SENSORS
Organization Name
Inventor(s)
Chayathorn Saklang of Mesa AZ (US)
Stephen Ryan Hooper of Queen Creek AZ (US)
[[:Category:Julien Ju�ry of Tempe AZ (US)|Julien Ju�ry of Tempe AZ (US)]][[Category:Julien Ju�ry of Tempe AZ (US)]]
LOW STRESS PACKAGING FOR ENVIRONMENTAL SENSORS
This abstract first appeared for US patent application 18464497 titled 'LOW STRESS PACKAGING FOR ENVIRONMENTAL SENSORS
Original Abstract Submitted
One or more sensor devices are encapsulated on a top surface of a carrier substrate within an elastomer material. The carrier substrate includes one or more recessed channels adjacent to each sensor device which are filled by a portion of the elastomer material to create flanged areas that are level with the top surface of the carrier substrate. A cover which can include a liquid or gas input port or other related structures can be placed over each sensor device and bonded to the carrier substrate at the flanged areas, creating a seal between the cover and the carrier substrate that surrounds each sensor device.
