18464091. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18464091 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a base film with peripheral regions and an inner region between them. A unit film package is placed on the inner region, defined by a cut line. Dummy patterns are located on the peripheral regions and between the cut line and the ends in the width direction. A first solder resist layer covers the unit film package inside the cut line and extends in the width direction, running across the cut line and covering the dummy patterns.
- The semiconductor package includes a base film with peripheral and inner regions, along with a unit film package defined by a cut line.
- Dummy patterns are strategically placed on the peripheral regions and between the cut line and the ends in the width direction.
- A first solder resist layer covers the unit film package inside the cut line and extends in the width direction, covering the dummy patterns as well.
Potential Applications: - This technology can be used in various semiconductor packaging applications where precise placement and protection of components are crucial. - It can be beneficial in industries requiring high-density packaging with efficient thermal management.
Problems Solved: - Provides a solution for protecting and organizing components within a semiconductor package. - Ensures proper coverage and protection of sensitive areas during the packaging process.
Benefits: - Enhanced protection and organization of components within the semiconductor package. - Improved thermal management and overall performance of the packaged semiconductor device.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Component Protection This technology can be utilized in the manufacturing of advanced electronic devices such as smartphones, tablets, and computers, where compact and efficient packaging is essential for optimal performance.
Questions about Semiconductor Packaging Technology: 1. How does the placement of dummy patterns contribute to the overall functionality of the semiconductor package? 2. What are the key advantages of using a first solder resist layer in semiconductor packaging applications?
Original Abstract Submitted
A semiconductor package includes a base film that has peripheral regions extending in a longitudinal direction and an inner region disposed between the peripheral regions and extending in the longitudinal direction. A unit film package is disposed on the inner region of the base film and is defined by a cut line. Dummy patterns are disposed on the peripheral regions of the base film and between the cut line and the opposite ends in the width direction. A first solder resist layer is disposed on the base film and covers the unit film package inside the cut line. In a plan view, the first solder resist layer extends in the width direction, runs across the cut line, and covers the dummy patterns.
