18463819. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
Contents
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Shunsuke Kamiya of Komatsu Ishikawa (JP)
Kazuhiro Murakami of Nomi Ishikawa (JP)
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18463819 titled 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation: The semiconductor device described in the patent application includes various components such as a conductive member, a solder layer, a chip, a coating film, an insulating part, and a sealing resin. The chip is positioned on the solder layer and is covered by an insulative coating film with a first covering part that protects the chip's perimeter edge. The insulating part is placed on the coating film, and the sealing resin seals all these components together.
- The semiconductor device comprises a conductive member, solder layer, chip, coating film, insulating part, and sealing resin.
- The chip is situated on the solder layer and is protected by an insulative coating film with a first covering part.
- An insulating part is placed on the coating film to provide additional protection.
- The sealing resin seals all the components together, ensuring the device's integrity.
Potential Applications: This technology can be utilized in various electronic devices, such as smartphones, tablets, laptops, and other consumer electronics. It can also find applications in industrial equipment, automotive electronics, and medical devices.
Problems Solved: This technology addresses the need for reliable and durable semiconductor devices by providing enhanced protection for the chip and other sensitive components. It helps prevent damage from environmental factors, mechanical stress, and other external threats.
Benefits: - Improved reliability and durability of semiconductor devices - Enhanced protection for sensitive components - Increased resistance to environmental factors and mechanical stress - Overall improved performance and longevity of electronic devices
Commercial Applications: Title: Enhanced Semiconductor Device for Improved Reliability This technology can be commercially applied in the manufacturing of various electronic devices to enhance their reliability and durability. It can attract interest from electronics manufacturers looking to improve the quality and longevity of their products, leading to potential market advantages.
Prior Art: Readers interested in exploring prior art related to this technology can start by researching patents and publications in the field of semiconductor device packaging, chip protection, and electronic component sealing.
Frequently Updated Research: Researchers in the field of semiconductor device packaging and protection are constantly working on improving the materials and techniques used to enhance the reliability and durability of electronic components. Stay updated on the latest advancements in chip packaging and sealing technologies for potential future developments in this area.
Questions about Semiconductor Device with Enhanced Protection: 1. What are the key components of the semiconductor device described in the patent application, and how do they work together to enhance protection? 2. How does the insulating part contribute to the overall reliability and durability of the semiconductor device?
Original Abstract Submitted
A semiconductor device includes a conductive member, a solder layer, a chip, a coating film, an insulating part, and a sealing resin. The solder layer is located on the conductive member. The chip is located on the solder layer. The coating film is insulative. The coating film is located on the chip. The coating film includes a first covering part. The first covering part covers an outer perimeter edge of an upper surface of the chip. The insulating part is located on the coating film. The sealing resin seals the solder layer, the chip, the coating film, and the insulating part.
