18462600. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation)

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MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

Organization Name

Intel Corporation

Inventor(s)

Omkar G. Karhade of Chandler AZ (US)

Nitin A. Deshpande of Chandler AZ (US)

Mohit Bhatia of Chandler AZ (US)

Debendra Mallik of Chandler AZ (US)

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18462600 titled 'MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

Simplified Explanation

The patent application describes microelectronic structures with bridges and related methods. Here is a simplified explanation of the abstract:

  • The microelectronic structure includes a substrate with two metal layers and a cavity in the substrate.
  • The first and second metal layers are partially exposed in the cavity, with the first metal layer overlapping the second metal layer.
  • A bridge component is present in the cavity, with a conductive contact on each face.
  • The second face of the bridge component is towards the bottom surface of the cavity, and the first metal layer is between the second face and the second metal layer.
  • The second conductive contact is electrically connected to the second metal layer in the cavity.

Potential applications of this technology:

  • Microelectronics manufacturing
  • Integrated circuits
  • Semiconductor devices

Problems solved by this technology:

  • Provides a structure for connecting different metal layers in a microelectronic device.
  • Allows for electrical connections between metal layers in a cavity.

Benefits of this technology:

  • Enables efficient and reliable electrical connections in microelectronic structures.
  • Provides a compact and space-saving design for connecting metal layers.
  • Enhances the performance and functionality of microelectronic devices.


Original Abstract Submitted

Disclosed herein are microelectronic structures including bridges, and related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate with first and second metal layers; a cavity in the substrate, where a portion of the first and second metal layers, are exposed with the portion of the first metal layer partially overlapping the portion of the second metal layer; and a bridge component in the cavity, having a first conductive contact at a first face and a second conductive contact at a second face opposing the first face, the second face towards a bottom surface of the cavity, the portion of the first metal layer is between the second face of the bridge component and the portion of the second metal layer, and the second conductive contact is electrically coupled to the portion of the second metal layer in the cavity.

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