18462049. INTEGRATED CIRCUIT DEVICES INCLUDING VIA CAPACITORS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
INTEGRATED CIRCUIT DEVICES INCLUDING VIA CAPACITORS
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Inventor(s)
INTEGRATED CIRCUIT DEVICES INCLUDING VIA CAPACITORS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18462049 titled 'INTEGRATED CIRCUIT DEVICES INCLUDING VIA CAPACITORS
Simplified Explanation
The abstract describes an integrated circuit device with a dielectric layer, first and second power delivery network layers on opposite surfaces of the dielectric layer, and a via capacitor connecting the two layers.
- The integrated circuit device includes a dielectric layer.
- There are first and second power delivery network layers on different surfaces of the dielectric layer.
- A via capacitor connects the first and second power delivery network layers.
- The via capacitor consists of two electrode structures spaced apart in horizontal directions.
- The end portions of the via capacitor are electrically connected to the power delivery network layers.
Potential Applications
- Integrated circuits
- Electronic devices
- Power delivery systems
Problems Solved
- Efficient power distribution
- Reduced signal interference
- Improved circuit performance
Benefits
- Enhanced power delivery
- Increased circuit reliability
- Compact design
Original Abstract Submitted
An integrated circuit device comprising: a dielectric layer; a first power delivery network layer on a first surface of the dielectric layer; a second power delivery network layer on a second surface of the dielectric layer, wherein the second surface is opposite to the first surface in a vertical direction; and a via capacitor between the first surface and the second surface of the dielectric layer, wherein the via capacitor includes a first via electrode structure and a second via electrode structure that are spaced apart from each other in one of a first horizontal direction and a second horizontal direction that intersects with the first horizontal direction, and a first end portion and a second end portion that is opposite to the first end portion of the via capacitor are electrically connected to the first power delivery network layer and the second power delivery network layer, respectively.
