18461040. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
HYUN SOO Chung of Suwon-si, Gyeonggi-do (KR)
DAE-WOO Kim of Suwon-si, Gyeonggi-do (KR)
WON-YOUNG Kim of Suwon-si, Gyeonggi-do (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18461040 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a first semiconductor chip with signal and power wiring structures, a second semiconductor chip with signal and power wiring structures, and a power connection pillar connecting the power wiring structures of the two chips.
- The semiconductor package features two semiconductor chips with different wiring structures.
- The first chip has signal wiring on its upper surface and power wiring on its lower surface.
- The second chip is placed on top of the first chip and has its own signal and power wiring structures.
- A power connection pillar links the power wiring structures of the two chips together.
Potential Applications: - This semiconductor package could be used in various electronic devices requiring efficient power distribution and signal transmission. - It may find applications in mobile phones, computers, and other consumer electronics.
Problems Solved: - The package addresses the need for effective power and signal distribution between multiple semiconductor chips in a compact space. - It streamlines the wiring connections, reducing complexity and improving overall performance.
Benefits: - Improved power efficiency and signal integrity. - Compact design for space-constrained applications. - Enhanced overall performance of electronic devices.
Commercial Applications: Title: Advanced Semiconductor Package for Enhanced Electronic Devices This technology could be valuable for semiconductor manufacturers looking to enhance the performance and efficiency of their electronic devices. It may have significant implications in the consumer electronics market, leading to more advanced and compact devices.
Questions about the technology: 1. How does the power connection pillar improve the efficiency of power distribution in the semiconductor package? The power connection pillar facilitates a direct and efficient connection between the power wiring structures of the two semiconductor chips, reducing power loss and improving overall performance.
2. What are the key advantages of having separate signal and power wiring structures in each semiconductor chip? Having separate signal and power wiring structures allows for optimized signal transmission and power distribution, minimizing interference and improving overall functionality.
Original Abstract Submitted
A semiconductor package is provided. The semiconductor package comprises a first semiconductor chip including the first signal wiring structure disposed in an upper surface thereof, and a first power wiring structure disposed in a lower surface thereof, a second semiconductor chip disposed on the first signal wiring structure and including a second signal wiring structure, a second power wiring structure disposed on the second semiconductor chip and a first power connection pillar connecting the first power wiring structure and the second power wiring structure to each other.
