18460679. OVERLAY MEASUREMENT METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
OVERLAY MEASUREMENT METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Organization Name
Inventor(s)
SEUNGHAK Park of Suwon-si (KR)
OVERLAY MEASUREMENT METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18460679 titled 'OVERLAY MEASUREMENT METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Simplified Explanation: The patent application describes a method for measuring overlay in a device structure by combining critical dimension (CD) information and tilt information to calculate a compensation overlay.
- **Key Features and Innovation:**
- Device structure with lower and upper stacks on a substrate. - Measurement of first overlay with CD information. - Measurement of second overlay with tilt information. - Calculation of compensation overlay by combining the first and second overlays. - Structures penetrating portions of the stacks in a vertical direction.
- **Potential Applications:**
- Semiconductor manufacturing. - Nanotechnology. - Optoelectronics.
- **Problems Solved:**
- Accurate measurement of overlay in complex device structures. - Compensation for tilt in overlay measurements.
- **Benefits:**
- Improved accuracy in overlay measurements. - Enhanced quality control in device fabrication. - Increased efficiency in manufacturing processes.
- **Commercial Applications:**
- Quality control systems for semiconductor industry. - Metrology equipment for nanotechnology research. - Inspection tools for optoelectronic device production.
- **Prior Art:**
- Researchers can explore prior patents related to overlay measurement methods in semiconductor manufacturing and nanotechnology.
- **Frequently Updated Research:**
- Stay updated on advancements in overlay measurement techniques in the semiconductor industry and related fields.
Questions about overlay measurement technology: 1. What are the potential challenges in implementing this overlay measurement method in large-scale manufacturing processes?
- Answer: The challenges may include calibration of measurement tools, integration with existing fabrication processes, and scalability for mass production.
2. How does this method compare to traditional overlay measurement techniques in terms of accuracy and efficiency?
- Answer: This method offers improved accuracy by combining CD and tilt information, leading to more precise compensation overlays and better quality control.
Original Abstract Submitted
An overlay measurement method includes providing a device structure including a substrate, a lower stack on the substrate and an upper stack on the lower stack, measuring a first overlay including critical dimension (CD) information of the device structure, measuring a second overlay including tilt information of the device structure, and calculating a compensation overlay by combining the first overlay and the second overlay, wherein the device structure has a first structure penetrating a portion of at least one of the lower stack or the upper stack in a vertical direction perpendicular to an upper surface of the substrate, and a second structure penetrating a portion of the lower stack and a portion of the upper stack in the vertical direction.
