18460504. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)

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SEMICONDUCTOR DEVICE

Organization Name

Mitsubishi Electric Corporation

Inventor(s)

Haruhiko Murakami of Tokyo (JP)

Yuji Miyazaki of Tokyo (JP)

Yasutaka Shimizu of Tokyo (JP)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18460504 titled 'SEMICONDUCTOR DEVICE

The semiconductor device described in the abstract consists of various metal patterns and semiconductor elements interconnected in a specific configuration.

  • The device includes a second metal pattern connected to a first semiconductor element and a second semiconductor element.
  • A third metal pattern is connected to the second semiconductor element.
  • A fifth metal pattern is connected to the third semiconductor element and a fourth semiconductor element.
  • A sixth metal pattern is connected to the fourth semiconductor element.
  • A first conductive portion bridges the third and sixth metal patterns, connecting the second and fifth metal patterns.

Potential Applications: - This semiconductor device could be used in integrated circuits for various electronic devices. - It may find applications in telecommunications, computing, and consumer electronics.

Problems Solved: - This device provides a specific layout for connecting different semiconductor elements efficiently. - It streamlines the electrical connections between various components in a semiconductor device.

Benefits: - Improved performance and reliability in semiconductor devices. - Enhanced efficiency in electronic circuits due to optimized connections.

Commercial Applications: Title: "Advanced Semiconductor Device for Enhanced Circuit Performance" This technology could be utilized in the production of high-performance electronic devices, leading to improved functionality and reliability in the market.

Prior Art: There may be existing patents or publications related to the specific layout and configuration of metal patterns and semiconductor elements in semiconductor devices.

Frequently Updated Research: Stay updated on the latest advancements in semiconductor device technology to ensure the most efficient and effective implementation of this innovation.

Questions about Semiconductor Device Technology: 1. How does the specific layout of metal patterns and semiconductor elements impact the overall performance of the device? 2. Are there any potential challenges in manufacturing semiconductor devices with this intricate interconnection design?


Original Abstract Submitted

A semiconductor device includes: a second metal pattern electrically connected to a first semiconductor element and a second semiconductor element; a third metal pattern electrically connected to the second semiconductor element; a fifth metal pattern electrically connected to the third semiconductor element and a fourth semiconductor element; a sixth metal pattern electrically connected to the fourth semiconductor element; and a first conductive portion straddling the third metal pattern and the sixth metal pattern in plan view and electrically connecting the second metal pattern and the fifth metal pattern.