18459771. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
Contents
- 1 SEMICONDUCTOR STORAGE DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR STORAGE DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.9.1 Unanswered Questions
- 1.9.2 How does this technology compare to existing cooling solutions in terms of cost-effectiveness and performance?
- 1.9.3 What specific materials are used in the construction of the capacitor and regulating plate, and how do they contribute to the overall effectiveness of the cooling system?
- 1.10 Original Abstract Submitted
SEMICONDUCTOR STORAGE DEVICE
Organization Name
Inventor(s)
Keishi Shimizu of Yokohama Kanagawa (JP)
SEMICONDUCTOR STORAGE DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18459771 titled 'SEMICONDUCTOR STORAGE DEVICE
Simplified Explanation
The semiconductor storage device described in the patent application includes a housing, a substrate, a first semiconductor component, a capacitor, and a first regulating plate. The substrate is housed within the housing, with the first semiconductor component mounted on it. The capacitor, which overlaps the first semiconductor component, is also located on the substrate. The first regulating plate guides airflow inside the housing towards a gap between the capacitor and the substrate.
- Housing with substrate and semiconductor component
- Capacitor overlapping semiconductor component on substrate
- Regulating plate directing airflow towards capacitor-substrate gap
Potential Applications
The technology described in this patent application could be applied in various electronic devices requiring efficient cooling and airflow management, such as smartphones, laptops, and servers.
Problems Solved
1. Improved thermal management in semiconductor storage devices. 2. Enhanced performance and reliability by regulating airflow around critical components.
Benefits
1. Increased efficiency and longevity of semiconductor components. 2. Better overall performance and reduced risk of overheating. 3. Potential for smaller form factors due to improved cooling capabilities.
Potential Commercial Applications
Optimized thermal management solutions for consumer electronics, data centers, and industrial applications.
Possible Prior Art
There may be prior art related to similar cooling solutions in electronic devices, such as heat sinks, fans, and other airflow management systems.
Unanswered Questions
How does this technology compare to existing cooling solutions in terms of cost-effectiveness and performance?
The article does not provide a direct comparison with other cooling solutions in the market, leaving the reader to wonder about the competitiveness of this technology.
What specific materials are used in the construction of the capacitor and regulating plate, and how do they contribute to the overall effectiveness of the cooling system?
The patent abstract does not delve into the specific materials used in the capacitor and regulating plate, leaving a gap in understanding the material science behind this innovation.
Original Abstract Submitted
A semiconductor storage device includes a housing, a substrate, a first semiconductor component, a capacitor, and a first regulating plate. The substrate is accommodated in the housing. The first semiconductor component is mounted on the substrate. The capacitor on the substrate, the capacitor includes a portion that overlaps the first semiconductor component from a side opposite to the substrate when viewed in a first direction, which is a thickness direction of the substrate. The first regulating plate guides at least a part of air, which flows inside the housing, toward a gap between the capacitor and the substrate.
