18459207. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Shun Takeda of Yokohama Kanagawa (JP)
Hiroshi Kono of Himeji Hyogo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18459207 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes multiple chips arranged in a specific order, with varying distances between them.
- The first chip is followed by a second chip, then a third chip closer to the second chip, and finally a fourth chip adjacent to the third chip.
- The distances between the chips are such that the first and second chips, as well as the third and fourth chips, are closer together than two other adjacent chips in the arrangement.
- This unique configuration of the chips allows for optimized performance and efficiency in the semiconductor device.
Potential Applications: This technology could be applied in various electronic devices such as smartphones, computers, and other consumer electronics where multiple chips need to work together efficiently.
Problems Solved: The arrangement of the chips in this semiconductor device addresses issues related to signal interference, heat dissipation, and overall performance optimization.
Benefits: The benefits of this technology include improved speed, reduced power consumption, and enhanced overall performance of electronic devices.
Commercial Applications: This technology could be highly valuable in the semiconductor industry, leading to the development of faster and more efficient electronic devices for consumers and businesses.
Questions about the technology: 1. How does the specific arrangement of chips in this semiconductor device improve performance? 2. What are the potential challenges in implementing this technology in mass-produced electronic devices?
Original Abstract Submitted
According to one embodiment, a semiconductor device includes a plurality of chips, in which the plurality of chips include a first chip, a second chip adjacent to the first chip on the other end side in the first direction, a third chip closer to the other end side in the first direction than the second chip, and a fourth chip adjacent to the third chip on the other end side in the first direction, which are arranged from one end side to the other end side in a first direction, and a first distance between the first chip and the second chip, and a second distance between the third chip and the fourth chip are less than a third distance between, among the plurality of chips, two chips adjacent to each other in a region closer to the other end side in the first direction than the first chip and closer to the one end side in the first direction than the fourth chip.
