18458056. PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)

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PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Organization Name

Kioxia Corporation

Inventor(s)

Koki Ueha of Yokkaichi Mie (JP)

Katsuyoshi Kodera of Yokohama Kanagawa (JP)

PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18458056 titled 'PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Simplified Explanation

The abstract describes a method for forming patterns using a template with recessed portions. The method involves placing imprint material on an object, pressing the template against the material to mold it, curing the molded material, and then removing the template.

  • The method uses a template with specific recessed portions that satisfy a particular relationship.
  • Imprint material is molded using the template and then cured to create patterns.

Potential Applications

This technology could be used in industries such as microelectronics, nanotechnology, and biotechnology for creating precise patterns on surfaces.

Problems Solved

This technology solves the problem of accurately and efficiently forming patterns on various objects or surfaces.

Benefits

The benefits of this technology include precise pattern formation, repeatability, and scalability for mass production.

Potential Commercial Applications

One potential commercial application of this technology could be in the manufacturing of microchips, where precise patterns are essential for functionality.

Possible Prior Art

Prior art may include similar methods of pattern formation using templates or molds in various industries.

Unanswered Questions

How does this method compare to traditional pattern forming techniques?

This article does not provide a direct comparison between this method and traditional techniques. It would be interesting to know the advantages and disadvantages of this new method in comparison to existing methods.

What materials are compatible with this pattern forming method?

The article does not specify the types of imprint materials that can be used with this method. Understanding the compatibility of different materials would be crucial for potential users of this technology.


Original Abstract Submitted

According to one embodiment, a pattern forming method uses a template having a first region with a first recessed portion and a second region adjacent to the first region. The second region has a second recessed portion therein. The recessed portions satisfy a specific relationship (D>2(H+H)/π), where Dis a shortest distance between the first and second recessed portions, His a depth of the first recessed portion, and His a depth of the second recessed portion. The pattern forming method includes placing an imprint material on an object and pressing the template against the material to mold the imprint material. The molded imprint material is then cured, and the template removed.