18457785. MOUNTING DEVICE AND MOUNTING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

MOUNTING DEVICE AND MOUNTING METHOD

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Masato Kajinami of Yokohama-shi (JP)

Hansung Cho of Suwon-si (KR)

Kazuya Ono of Suwon-si (KR)

Byeongjin Kim of Suwon-si (KR)

Daisuke Nagatomo of Yokohama-shi (JP)

Fumitaka Moroishi of Yokohama-shi (JP)

Masanori Izumita of Yokohama-shi (JP)

Sungmin Ahn of Suwon-si (KR)

MOUNTING DEVICE AND MOUNTING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18457785 titled 'MOUNTING DEVICE AND MOUNTING METHOD

Simplified Explanation

The patent application describes mounting devices and methods for high-precision mounting using a bonding actuator with multiple voice coil motors.

• The mounting device includes a housing, a slider with a head, a coil, and a yoke, and multiple voice coil motors in different directions.
• The bonding actuator adjusts the position and parallelism of a chip and a wafer by driving the slider in six axial directions.

Key Features and Innovation

• Mounting device with a bonding actuator and multiple voice coil motors for high-precision mounting.
• Slider accommodated in a non-contact state with a head, coil, and yoke for adjusting position and parallelism.
• Voice coil motors in X, Y, and Z-axis directions for precise control during bonding process.

Potential Applications

The technology can be used in semiconductor manufacturing, microelectronics assembly, and other industries requiring high-precision mounting processes.

Problems Solved

The technology addresses the need for high-precision mounting of chips and wafers with accurate position and parallelism control.

Benefits

• Improved accuracy and precision in mounting processes.
• Enhanced quality and reliability of bonded components.
• Increased efficiency and productivity in manufacturing operations.

Commercial Applications

• Semiconductor manufacturing industry for bonding chips and wafers.
• Microelectronics assembly for precise component mounting.
• Research and development labs for high-precision positioning applications.

Prior Art

No specific information on prior art related to this technology is provided in the abstract.

Frequently Updated Research

There is no information on frequently updated research related to this technology.

Questions about Mounting Devices and Methods

Question 1

How does the bonding actuator adjust the position and parallelism of the chip and wafer during the mounting process?

The bonding actuator adjusts the position and parallelism by driving the slider in six axial directions, including the X, Y, and Z-axis directions, as well as Tx, Ty, and Tz directions.

Question 2

What are the potential benefits of using multiple voice coil motors in different directions for high-precision mounting?

Using multiple voice coil motors allows for precise control and adjustment of the position and parallelism of the components, resulting in improved accuracy and reliability in the mounting process.

Original Abstract Submitted

Provided are mounting devices and mounting methods configured to realize high-precision mounting. A mounting device including a bonding actuator having a housing, a slider accommodated in the housing in a non-contact state and provided with a head, a coil and a yoke in a non-contact state, two voice coil motors (VCMs) driven in an X-axis direction, three VCMs driven in a Y-axis direction, and one VCM driven in a Z-axis direction may be provided. The coil may be fixed to the housing and the yoke may be fixed to the slider. The bonding actuator may perform bonding while adjusting a relative position and parallelism of a chip and a wafer, by driving the slider in six axial directions, which include the X-axis direction, the Y-axis direction, the Z-axis direction, a Tx direction, a Ty direction, and a Tz direction.