18457535. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
KYOUNG LIM Suk of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18457535 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of multiple layers and chips interconnected through various structures. Here is a simplified explanation of the abstract:
- A semiconductor package with multiple layers and chips stacked on top of each other. - The layers include redistribution layers and connection structures. - Connection posts and interconnection layers facilitate the electrical connections between the chips. - The second redistribution layer and the first redistribution layer are connected through a wire.
Key Features and Innovation: - Stacked semiconductor chips with redistribution layers for efficient electrical connections. - Connection structures and interconnection layers for seamless chip-to-chip communication. - Use of wires to connect different redistribution layers for enhanced functionality.
Potential Applications: - Advanced semiconductor packaging for high-performance electronic devices. - Suitable for applications requiring compact and efficient chip stacking. - Ideal for industries such as telecommunications, computing, and consumer electronics.
Problems Solved: - Improved electrical connectivity between stacked semiconductor chips. - Enhanced reliability and performance of semiconductor packages. - Streamlined design for compact and efficient electronic devices.
Benefits: - Increased functionality and performance of electronic devices. - Enhanced reliability and durability of semiconductor packages. - Cost-effective solution for advanced chip stacking applications.
Commercial Applications: - Title: Advanced Semiconductor Packaging for High-Performance Devices - Potential commercial uses in telecommunications infrastructure. - Market implications include improved efficiency and performance in electronic devices.
Questions about Semiconductor Package Technology: 1. How does the use of multiple redistribution layers improve the performance of semiconductor packages? 2. What are the key advantages of using connection posts and interconnection layers in stacked chip designs?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging technology for improved performance and reliability.
Original Abstract Submitted
A semiconductor package includes a first redistribution layer; a first semiconductor chip above the first redistribution layer; a second semiconductor chip above the first semiconductor chip; a second redistribution layer above the second semiconductor chip; a first connection structure on the second redistribution layer; a connection post on the first connection structure; and a connection interconnection layer on the connection post, wherein the connection interconnection layer comprises a connection insulating layer and a connection via extending through the connection insulating layer, and wherein the second redistribution layer and the first redistribution layer are electrically connected to each other through a wire.
