18456865. INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
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INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18456865 titled 'INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation: The patent application describes an integrated circuit device that includes two semiconductor chips connected through an interposer using signal through silicon vias (TSVs) and signal bumps. By reducing the area occupied by the signal TSVs in the first semiconductor chip, the device achieves a smaller size.
- The integrated circuit device includes a first semiconductor chip with signal TSVs, a second semiconductor chip with signal bumps, and an interposer connecting the two chips.
- The signal TSVs in the first semiconductor chip have a smaller pitch compared to the signal bumps on the lower surface of the second semiconductor chip.
- The interposer electrically connects the signal TSVs with the signal bumps, enabling communication between the two chips.
- By decreasing the area occupied by the signal TSVs, the integrated circuit device achieves a smaller overall size.
Potential Applications: 1. Consumer electronics 2. Telecommunications 3. Automotive industry 4. Medical devices
Problems Solved: 1. Reducing the size of integrated circuit devices 2. Improving signal transmission between semiconductor chips 3. Enhancing overall device performance
Benefits: 1. Smaller form factor 2. Improved efficiency 3. Enhanced connectivity 4. Higher performance capabilities
Commercial Applications: The technology can be utilized in various industries such as consumer electronics, telecommunications, automotive, and medical devices to create smaller and more efficient integrated circuit devices.
Prior Art: Prior research in the field of semiconductor packaging and interconnection technologies may provide insights into similar approaches to improving signal transmission between semiconductor chips.
Frequently Updated Research: Researchers are continuously exploring new methods to enhance the performance and efficiency of integrated circuit devices through advanced packaging and interconnection techniques.
Questions about Integrated Circuit Devices: 1. How do signal through silicon vias (TSVs) contribute to improving the performance of integrated circuit devices? 2. What are the key challenges in implementing interposers for connecting semiconductor chips in integrated circuit devices?
Original Abstract Submitted
An integrated circuit device including a first semiconductor chip, a plurality of signal through silicon vias (TSV), a second semiconductor chip, a plurality of signal bumps and an interposer may be provided. The signal TSVs may be in the first semiconductor chip by a first pitch. The second semiconductor chip may be on the first semiconductor chip. The signal bumps may be on a lower surface of the second semiconductor chip by a second pitch wider than the first pitch. The interposer may be interposed between the first semiconductor chip and the second semiconductor chip and may be electrically connecting the signal TSVs with the signal bumps. Thus, an occupying area of the signal TSVs in the first semiconductor chip may be decreased so that the integrated circuit device may have a smaller size.
