18455946. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Satoshi Yoshida of Kawasaki (JP)
Tatsunori Sakano of Tokyo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18455946 titled 'SEMICONDUCTOR DEVICE
The semiconductor chip described in the patent application consists of various components such as a semiconductor layer, electrodes, gate pads, and terminals for electrical connections.
- The semiconductor chip includes a semiconductor layer, electrodes, gate pads, and terminals for electrical connections.
- The first electrode is located between a conductive member and the semiconductor layer.
- There are two gate pads, one located between the first conductive member and the semiconductor layer, and the other located between the first conductive member and the semiconductor layer.
- The second electrode is located between the semiconductor layer and a second conductive member.
- The terminals include a first gate terminal connected to the first gate pad, a second gate terminal connected to the second gate pad, and a sense terminal connected to the first conductive member.
- The sense terminal is positioned between the first gate terminal and the second gate terminal in a plan view perpendicular to a first direction.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices. - It can be applied in the development of high-performance electronic components.
Problems Solved: - Provides a more efficient and reliable way to connect various components in a semiconductor chip. - Enhances the overall performance and functionality of semiconductor devices.
Benefits: - Improved connectivity and functionality in semiconductor chips. - Enhanced performance and reliability of electronic devices.
Commercial Applications: Title: Advanced Semiconductor Chip Technology for Enhanced Performance This technology can be utilized in the production of high-end electronic devices such as smartphones, computers, and other consumer electronics. It can also be integrated into industrial applications where high-performance semiconductor chips are required.
Questions about the technology: 1. How does this semiconductor chip technology improve the performance of electronic devices? 2. What are the key advantages of using this advanced semiconductor chip in various applications?
Frequently Updated Research: Stay updated on the latest advancements in semiconductor chip technology to ensure optimal performance and reliability in electronic devices. Regularly check for new research findings and developments in the field to stay ahead of the competition.
Original Abstract Submitted
A semiconductor chip includes a semiconductor layer, a first electrode located between a first conductive member and the semiconductor layer, a first gate pad located between the first conductive member and the semiconductor layer, a second gate pad located between the first conductive member and the semiconductor layer, and a second electrode located between the semiconductor layer and a second conductive member. A plurality of terminals includes a first gate terminal electrically connected to the first gate pad via the interconnection member, a second gate terminal electrically connected to the second gate pad via the interconnection member, and a sense terminal electrically connected to the first conductive member via the interconnection member. The sense terminal is located between the first gate terminal and the second gate terminal in a plan view perpendicular to a first direction.
