18454994. SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE simplified abstract (FUJI ELECTRIC CO., LTD.)
Contents
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
Organization Name
Inventor(s)
Mai Saito of Kawasaki-shi (JP)
Daiki Yoshida of Kawasaki-shi (JP)
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18454994 titled 'SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
The semiconductor module described in the patent application consists of a circuit board with a semiconductor element mounted on it, a lead with a bonding portion connected to the semiconductor element and a wiring portion, and a sealing material that seals the semiconductor element and the lead.
- The lead has a bent portion connected to the bonding portion at a side where the first side surface is located, with the bent portion bent away from the lower surface of the bonding portion.
- The border between the bonding portion and the bent portion is located between the first and second side surfaces of the bonding portion in a plan view of the lead.
Potential Applications: - This technology can be used in various electronic devices that require reliable semiconductor modules with sealed components. - It can be applied in automotive electronics, industrial machinery, and consumer electronics.
Problems Solved: - Provides a secure and sealed environment for the semiconductor element, protecting it from external factors. - Ensures a strong connection between the semiconductor element and the lead, enhancing the overall performance of the module.
Benefits: - Improved reliability and durability of semiconductor modules. - Enhanced protection for sensitive semiconductor elements. - Simplified manufacturing process for electronic devices.
Commercial Applications: Title: Advanced Semiconductor Module Technology for Enhanced Device Reliability This technology can be utilized in the production of high-performance electronic devices, such as smartphones, laptops, and automotive control systems, to ensure long-term reliability and performance.
Prior Art: Researchers can explore prior patents related to semiconductor module design, lead bonding techniques, and sealing materials to gain a deeper understanding of the existing technology landscape in this field.
Frequently Updated Research: Researchers and engineers can stay updated on the latest advancements in semiconductor module design, materials science, and electronic packaging techniques to further enhance the performance and reliability of electronic devices.
Questions about Semiconductor Module Technology: 1. How does the sealing material used in this semiconductor module technology contribute to the overall reliability of the device? 2. What are the key factors to consider when designing the lead bonding portion for optimal performance in semiconductor modules?
Original Abstract Submitted
A semiconductor module includes a circuit board having a semiconductor element mounted thereon, a lead including a first bonding portion bonded to the semiconductor element via a bonding material and a wiring portion connected to the first bonding portion, and a sealing material that seals the semiconductor element and the lead. The first bonding portion has first and second side surfaces that face each other. The wiring portion has a bent portion connected to the first bonding portion at a side of the first bonding portion at which the first side surface is located. The bent portion is bent at a border between the first bonding portion and the bent portion in a direction away from a lower surface of the first bonding portion. The border is located between the first and second side surfaces of the first bonding portion in a plan view of the lead.
