18454505. DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., LTD.)
Contents
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Donghyun Son of Yongin-si (KR)
Jongseok Kim of Yongin-si (KR)
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18454505 titled 'DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The patent application describes a display apparatus with a substrate that has a component area, a main area, and a bending area. The apparatus includes a buffer layer, a semiconductor layer, and a gate insulating layer with an opening and a through-hole.
- The display apparatus includes a substrate with different areas and a bending area.
- A buffer layer is placed on the substrate, followed by a semiconductor layer.
- A gate insulating layer overlaps the semiconductor layer and has an opening and a through-hole.
- The opening has a smaller angle with respect to the substrate surface compared to the through-hole.
- Potential Applications
- Flexible displays for smartphones, tablets, and wearable devices.
- Curved displays for automotive dashboards and instrument panels.
- Problems Solved
- Allows for bending of the display without damaging the semiconductor layer.
- Ensures proper functioning of the display in curved or flexible configurations.
- Benefits
- Increased durability and flexibility of displays.
- Enables innovative design possibilities for various electronic devices.
Original Abstract Submitted
A display apparatus includes a substrate including a component area including a transmission area, a main area outside the component area, and a bending area bent based on a bending axis, a buffer layer disposed on the substrate, a first semiconductor layer disposed on the buffer layer, and a first gate insulating layer overlapping the first semiconductor layer and including a 1-1opening corresponding to the bending area, and a 1-1through-hole exposing a portion of the first semiconductor layer. A first acute angle formed by an inner surface of the 1-1opening with respect to an upper surface of the substrate is less than a first contact acute angle formed by an inner surface of the 1-1through-hole with respect to the upper surface of the substrate.