18454278. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Youngjun Yoon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18454278 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of two semiconductor chips, each with different connection pads and through-electrodes. The package also includes protective layers, bump structures, and an adhesive film for electrical connections and protection.
- First semiconductor chip with front and rear connection pads, dummy pads, and through-electrodes
- Second semiconductor chip with front connection pads, test pads, and protective layer with openings
- Bump structures connecting rear connection pads of the first chip to front connection pads of the second chip
- Adhesive film surrounding rear connection pads, dummy pads, and bump structures
- Dummy pads overlapping test pads and having a greater height than rear connection pads
Potential Applications: - Integrated circuits - Microelectronics - Semiconductor packaging industry
Problems Solved: - Improved electrical connections between semiconductor chips - Enhanced protection for connection pads - Facilitated testing processes
Benefits: - Increased reliability of semiconductor packages - Simplified testing procedures - Enhanced performance of electronic devices
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Connectivity This technology can be utilized in the production of various electronic devices, such as smartphones, computers, and automotive electronics, to improve their performance and reliability.
Questions about the technology: 1. How does the height difference between dummy pads and rear connection pads impact the functionality of the semiconductor package? - The height difference allows for better alignment and contact between the dummy pads and test pads, ensuring accurate testing procedures. 2. What are the advantages of using protective layers with openings in semiconductor packaging? - Protective layers with openings provide access to specific connection pads for testing and maintenance purposes, without compromising the overall protection of the semiconductor chips.
Original Abstract Submitted
A semiconductor package includes a first semiconductor chip including first front connection pads on a first front surface, first rear connection pads and dummy pads on a first rear surface, and through-electrodes. The package includes a second semiconductor chip including second front connection pads and test pads on a second front surface, and a protective layer including openings exposing at least a portion of the second front connection pads and the test pads. The package includes bump structures electrically connecting the first rear connection pads and the second front connection pads, and an adhesive film surrounding at least a portion of each of the first rear connection pads, the dummy pads, and the bump structures. The dummy pads overlap the test pads in a direction perpendicular to the first rear surface, and a height of the dummy pads is greater than a height of the first rear connection pads.
