18453713. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
Contents
- 1 SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Shinichiro Adachi of Matsumoto-city (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18453713 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract includes a cooling device with a cooling top plate, a case with a frame portion, an insulated circuit board with a semiconductor chip, a W-phase output terminal, and a current detection unit embedded within the frame portion.
- The semiconductor device includes an insulated circuit board with a semiconductor chip.
- The device has a cooling device with a cooling top plate for heat dissipation.
- A case with a frame portion provides protection and storage for the circuit board.
- The W-phase output terminal is electrically connected to the semiconductor chip.
- A current detection unit is embedded within the frame portion for monitoring output current flow.
Potential Applications
This technology could be applied in various electronic devices requiring efficient cooling and current monitoring, such as power supplies, inverters, and motor drives.
Problems Solved
This technology solves the issues of overheating in semiconductor devices and provides a convenient way to monitor output current flow for optimal performance and safety.
Benefits
The benefits of this technology include improved thermal management, enhanced reliability of semiconductor devices, and real-time monitoring of output current for better control and protection.
Potential Commercial Applications
Potential commercial applications of this technology include industrial electronics, renewable energy systems, electric vehicles, and consumer electronics.
Possible Prior Art
One possible prior art could be semiconductor devices with external current detection units or cooling systems, but embedding the current detection unit within the frame portion for compactness and efficiency may be a novel feature of this technology.
What are the specific technical specifications of the semiconductor chip used in this device?
The specific technical specifications of the semiconductor chip used in this device are not provided in the abstract. Further details on the type of semiconductor chip, its processing power, and compatibility with different applications would be necessary to fully understand the capabilities of this semiconductor device.
How does the current detection unit communicate the detected output current information to the user or system?
The abstract does not mention how the current detection unit communicates the detected output current information to the user or system. It would be important to know if the current detection unit has any display interface, communication protocols, or data logging capabilities to relay the output current information effectively for monitoring and analysis purposes.
Original Abstract Submitted
A semiconductor device includes an insulated circuit board having a semiconductor chip thereon, a W-phase output terminal electrically connected to the chip, a cooling device including a cooling top plate having a top surface on which the insulated circuit board is disposed, and a case including a frame portion on the cooling top plate and having an open storage area in which the insulated circuit board is stored, and a current detection unit for detecting an output current flowing through the output terminal. The output terminal extends from the unit storage portion to an outside the case and passes through the current detection unit. The current detection unit is embedded within the frame portion such that a shortest external dimension thereof is parallel to a first direction that is perpendicular to the top surface in the cooling area of the cooling top plate.
