18453611. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Joonghyun Baek of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18453611 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a substrate, at least one controller chip, at least one chip structure with a buffer chip, upper and lower chip stacks, upper and lower wires for electrical connections, connection wires, and connection bumps below the substrate.
- The semiconductor package includes a substrate for support.
- At least one controller chip is mounted on the substrate.
- The chip structure consists of a buffer chip, upper chip stack, and lower chip stack.
- Upper wire electrically connects the upper chip stack, buffer chip, and controller chip.
- Lower wire electrically connects the lower chip stack and controller chip.
- Connection wire electrically connects the controller chip to the substrate.
- Connection bumps below the substrate are electrically connected to the controller chip and chip structure.
Potential Applications
This technology can be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology solves the problem of efficiently connecting multiple chips within a semiconductor package while maintaining electrical integrity and reliability.
Benefits
The benefits of this technology include improved performance, compact design, enhanced electrical connectivity, and overall reliability of the semiconductor package.
Potential Commercial Applications
- "Innovative Semiconductor Package Design for Enhanced Performance and Reliability"
Possible Prior Art
There may be prior art related to semiconductor packaging techniques, multi-chip modules, and wire bonding methods.
Unanswered Questions
How does this technology compare to traditional single-chip packaging methods?
This technology offers the advantage of integrating multiple chips within a single package, potentially reducing overall size and improving performance.
What are the potential challenges in implementing this technology on a large scale?
Some challenges may include optimizing the manufacturing process, ensuring compatibility with existing devices, and addressing any potential reliability issues that may arise during operation.
Original Abstract Submitted
A semiconductor package may include a substrate; at least one controller chip on the substrate; at least one chip structure on the substrate, the at least one chip structure including a buffer chip, an upper chip stack on the buffer chip, and a lower chip stack below the buffer chip; an upper wire electrically connecting the upper chip stack, the buffer chip, and the at least one controller chip; a lower wire electrically connecting the lower chip stack and the at least one controller chip; a connection wire electrically connecting the at least one controller chip to the substrate; and connection bumps below the substrate, the connection bumps being electrically connected to the at least one controller chip and the at least one chip structure.
