18453422. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SUNG KEUN Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18453422 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a redistribution substrate with an insulating layer and a first redistribution pattern, along with a semiconductor chip connected to the substrate. The first redistribution pattern consists of a first barrier layer, a second barrier layer, and a via structure.
- The first barrier layer is made of a first conductive material, while the second barrier layer is made of a second conductive material different from the first.
- The via structure is located on the second barrier layer, providing electrical connections within the package.
Potential Applications: - This technology can be used in various semiconductor devices and electronic components that require efficient electrical connections. - It can be applied in the manufacturing of advanced integrated circuits and microprocessors.
Problems Solved: - Provides a reliable and efficient method for redistributing electrical connections within semiconductor packages. - Enhances the overall performance and reliability of semiconductor devices.
Benefits: - Improved electrical connectivity and signal transmission within semiconductor packages. - Enhanced durability and longevity of electronic components.
Commercial Applications: - This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and automotive electronics. - It has the potential to impact the semiconductor industry by improving the efficiency and reliability of semiconductor packages.
Questions about the Technology: 1. How does the use of different conductive materials in the barrier layers enhance the performance of the semiconductor package? 2. What are the specific advantages of the via structure in improving electrical connections within the package?
Original Abstract Submitted
A semiconductor package, comprising a redistribution substrate including an insulating layer and a first redistribution pattern; and a semiconductor chip electrically connected to the redistribution substrate, wherein the first redistribution pattern comprises a first barrier layer; a second barrier layer on the first barrier layer; and a via structure on the second barrier layer, wherein the first barrier layer comprises a first conductive material and the second barrier layer comprises a second conductive material different from the first conductive material.
