18453378. PLASMA PROCESSING APPARATUS AND METHOD simplified abstract (Samsung Electronics Co., Ltd.)

PLASMA PROCESSING APPARATUS AND METHOD

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Changheon Lee of Suwon-si (KR)

Sangki Nam of Suwon-si (KR)

Kuihyun Yoon of Suwon-si (KR)

Kiho Lee of Suwon-si (KR)

Sangho Lee of Suwon-si (KR)

Sangheun Lee of Suwon-si (KR)

Jaemin Rhee of Suwon-si (KR)

Junghyun Cho of Suwon-si (KR)

Seoyeon Choi of Suwon-si (KR)

PLASMA PROCESSING APPARATUS AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18453378 titled 'PLASMA PROCESSING APPARATUS AND METHOD

Simplified Explanation: The patent application describes a plasma processing apparatus with a substrate chuck, a restriction ring, a movable ring, and an actuator to control the movement of the rings. The grooves in the restriction ring can be opened or closed by the movement of the movable ring.

Key Features and Innovation:

• Plasma processing apparatus with movable rings for controlling grooves in the restriction ring.
• Actuator to move the rings for precise control over the plasma processing.
• Enhanced efficiency and accuracy in plasma processing operations.
• Improved uniformity and consistency in processing results.
• Potential for customization and optimization of processing parameters.

Potential Applications: The technology can be applied in semiconductor manufacturing, flat panel display production, and other industries requiring precise plasma processing.

Problems Solved:

• Inconsistent processing results due to lack of control over plasma distribution.
• Difficulty in achieving uniformity in plasma processing.
• Limited customization options for specific processing requirements.

Benefits:

• Enhanced control and precision in plasma processing.
• Improved uniformity and consistency in processing results.
• Customizable parameters for specific processing needs.
• Increased efficiency and productivity in manufacturing processes.

Commercial Applications: The technology can be utilized in semiconductor fabrication facilities, display panel manufacturing plants, and other industrial settings requiring advanced plasma processing capabilities.

Questions about Plasma Processing Apparatus: 1. How does the movable ring in the plasma processing apparatus contribute to the control of grooves in the restriction ring? 2. What are the potential advantages of using this innovative plasma processing technology in semiconductor manufacturing?

Original Abstract Submitted

Provided is a plasma processing apparatus including a substrate chuck in a chamber, a restriction ring surrounding an outer perimeter of the substrate chuck, a movable ring on the restriction ring, and an actuator configured to move the movable ring, wherein grooves formed in the restriction ring are opened or closed by movement of the movable ring. In addition, provided is a plasma processing method using the plasma processing apparatus.